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Optical assembly packaging structure

A packaging structure and optical component technology, applied in the direction of electrical components, electrical solid-state devices, semiconductor devices, etc., can solve the problems of reducing product life, reducing measurement accuracy, mutual interference, etc., to reduce production costs and improve accuracy , the effect of good signal-to-noise ratio

Active Publication Date: 2018-05-25
PIXART IMAGING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, placing so many electronic components in a small space is not only likely to generate mutual interference noise, but also external temperature changes will affect the stability of electronic components and reduce the service life of the product, further reducing the accuracy of measurement

Method used

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  • Optical assembly packaging structure

Examples

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no. 1 example 〕

[0034] see figure 1 , figure 1 It is a schematic diagram of the packaging structure of the optical component according to the first embodiment of the present invention. It can be seen from the above figures that the first embodiment of the present invention provides an optical component packaging structure 10 including a far-infrared sensor chip 110 , a packaging shell 120 , a first metal layer 130 and a cover 140 . The far-infrared sensor chip 110 includes a semiconductor substrate 112 and a semiconductor stack structure 114 . The semiconductor substrate 112 has a first surface S1, a second surface S2 opposite to the first surface S1, and a cavity 112a. In this embodiment, the semiconductor substrate 112 is illustrated by taking a silicon substrate as an example. In other embodiments, the semiconductor substrate 112 may also adopt other substrates that are properly matched with the semiconductor stack structure 114 . In addition, the semiconductor stack structure 114 is di...

no. 2 example

[0041] see figure 2 , figure 2 It is a schematic diagram of the packaging structure of the optical component according to the second embodiment of the present invention. The optical component packaging structure 10 a of the second embodiment of the present invention is similar to the optical component packaging structure 10 of the first embodiment of the present invention, and the similarities can be referred to above, and will not be repeated here. The difference between the optical component packaging structure 10a of the second embodiment of the present invention and the optical component packaging structure 10 of the first embodiment of the present invention is that the packaging housing 120 of the optical component packaging structure 10a of the second embodiment of the present invention includes a plurality of The metal wires (131, 132) located in the package casing 120, and part of the metal wires (131, 132) are electrically connected with the far-infrared sensing ch...

no. 3 example

[0044] see image 3 , image 3 It is a schematic diagram of the packaging structure of the optical component according to the third embodiment of the present invention. The optical component packaging structure 10b of the third embodiment of the present invention is similar to the optical component packaging structure 10 of the first embodiment of the present invention, and similar parts can be referred to above, and will not be repeated here. The difference between the optical component packaging structure 10b of the third embodiment of the present invention and the optical component packaging structure 10 of the first embodiment of the present invention is that the cover 140 of the optical component packaging structure 10b of the third embodiment of the present invention includes a light-transmitting The substrate 142 and a second metal layer 144, the second metal layer 144 is disposed on the transparent substrate 142 and has a first opening 144a exposing the transparent su...

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Abstract

The invention discloses an optical assembly packaging structure. The optical assembly packaging structure herein includes an infrared sensing chip, a first metal layer, a packaging housing and a coverbody. The infrared sensing chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface and a cavity. The semiconductor stack structure is configured on the first surface of the semiconductor substrate, and part of the semiconductor stack structure is disposed above the cavity.The first metal layer is configured on the second surface of the semiconductor substrate. The packaging housing packages the infrared sensing chip and exposes at least part of the infrared sensing chip, and the cover body is configured above the semiconductor stack structure. According to the invention, the optical assembly packaging structure can prolong the service life of products, exhibits excellent signal to noise ratio, increases measuring accuracy of the sensing chip, is thinner in size, and has a low production cost.

Description

technical field [0001] The invention relates to an optical component packaging structure, in particular to a thin optical component packaging structure with infrared light shielding and constant temperature. Background technique [0002] In response to the demand for lightweight multifunctional digital products in today's market, a product may have multiple sensor chips and other electronic components with different functions placed in the same space. For example, a multifunctional smart watch may have Heartbeat, blood pressure, body temperature and other sensing chips and light sources, etc. Therefore, the demand for thinning these electronic components is also increasing. However, placing so many electronic components in a small space is not only likely to generate mutual interference noise, but also external temperature changes will affect the stability of electronic components and reduce the service life of the product, further reducing the accuracy of measurement. Ther...

Claims

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Application Information

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IPC IPC(8): H01L23/057
CPCH01L23/057H01L2224/11H01L2224/48091H01L2924/16151H01L2924/16152H01L2924/16195H01L2924/00014
Inventor 张义昌陈彦欣沈启智
Owner PIXART IMAGING INC
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