Encapsulation structure and preparation method of organic light emitting device
A technology of organic light-emitting devices and packaging structures, which is applied in the direction of organic semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problems of device failure, increase the difficulty of preparation, and the unevenness of the film layer, so as to improve the light extraction efficiency and Effect
Active Publication Date: 2019-08-02
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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Problems solved by technology
[0003] At present, the flexible organic light-emitting diode display (Organic Light-Emitting Diode, OLED) is a main research direction in the future, which is mainly prepared by the method of thin film packaging, but due to the height difference between the pixel area and the non-pixel area, this causes In the process of thin film packaging, it is easy to make the film layer form an uneven and uneven state, and it is easy to cause the film layer to break at the edge of the light-emitting area, thereby causing the device to fail
The light extraction technology is currently mainly in the device or on the substrate, which increases the difficulty of preparation and affects the luminous efficiency of the device.
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[0011] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0012] see figure 1 , figure 1 It is a schematic flowchart of an embodiment of a method for preparing an organic light emitting device packaging structure in the present application.
[0013] S10, preparing a base substrate with light-emitting pixels.
[0014] Please also refer to figure 2 , figure 2 It is a schematic diagram of the preparation of the organic light-emitting device packaging structure of the present application, and in step S...
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The present application discloses a package structure and preparation method of an organic light-emitting device. The package structure includes: a substrate on which light-emitting pixels are prepared; a first barrier layer arranged on the substrate; a nanoparticle layer arranged on the The first barrier layer corresponds to the position of the light-emitting pixel; the buffer layer is arranged on the non-nanoparticle layer area of the first barrier layer; the second barrier layer is arranged on the nanoparticle layer and the buffer layer. Through the above method, the present application can perform separate light extraction on the light-emitting pixels, avoiding waste of materials and reducing production costs.
Description
technical field [0001] The present application relates to the field of display technology, in particular to a packaging structure and a manufacturing method of an organic light-emitting device. Background technique [0002] In the current field of lighting and display, due to the characteristics of organic electroluminescence, such as low starting voltage, thinness and self-luminescence, etc., it is more and more used in the development of lighting products and panel industries to meet the requirements of low energy consumption, thinness and lightness. and surface light sources. [0003] At present, the flexible organic light-emitting diode display (Organic Light-Emitting Diode, OLED) is a main research direction in the future, which is mainly prepared by the method of thin film packaging, but due to the height difference between the pixel area and the non-pixel area, this causes During the thin film encapsulation process, it is easy to cause the film layer to form an uneve...
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IPC IPC(8): H01L51/52H01L51/56
CPCH10K59/873H10K59/879H10K59/40H10K77/111H10K2102/331H10K2102/351H10K2102/311H10K50/858H10K50/844H10K50/8426H10K71/00H10K59/00H10K2102/00
Inventor 黄辉
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD