Small-dimension circuit board molding processing method without inner positioning
A molding process, circuit board technology, applied in the processing of insulating substrates/layers, printed circuits, printed circuit manufacturing, etc., can solve the problems of easy-to-scratch board surface, long process, high cost, etc., to reduce labor and reduce production cost, productivity improvement effect
Active Publication Date: 2018-06-05
JIANGMEN SUNTAK CIRCUIT TECH +1
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Problems solved by technology
[0004] The present invention aims at the problems of long process, low efficiency, high cost and easy scratching of the surface of the board during cleaning in the existing small-size unit board molding processing method, and provides a small-size circuit board molding processing method without internal positioning. Eliminate the material consumption of tapes and the process of manually pasting and tearing tapes, which improves production efficiency and reduces production costs; it also solves the problem that small-sized unit boards (circuit boards) cannot be cleaned by finished products
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Embodiment 1
[0026] Such as Figure 1 to Figure 5 As shown, the manufacturing method of a circuit board shown in this embodiment, especially one of the small-sized circuit board forming and processing methods without internal positioning, the circuit board manufacturing method includes the following processing steps in sequence: cutting → inner Layer circuit production→pressing→drilling→immersion copper→full board electroplating→outer layer circuit production→solder mask→silk printing characters→surface treatment→forming→electrical performance test→final inspection, the specific steps are as follows:
[0027] (1) Cutting: cut out the core board according to the panel size 520mm×620mm, the thickness of the core board is 0.5mm, and the thickness of the outer copper foil of the core board is 0.5OZ.
[0028] (2), inner layer circuit production (negative film process): inner layer graphics transfer, use vertical coating machine to coat photosensitive film, the film thickness of photosensitive f...
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The invention discloses a small-dimension circuit board molding processing method without inner positioning. The method comprises the following steps of cutting a produced board to an elongated boardwhich is composed of a row of unit boards and an outer frame at the outer periphery of the elongated board through routing, wherein two ends of the elongated board are connected with the frame; the produced board is the board after surface treatment, and the produced board comprises at least one row of unit boards; performing V-cutting on two surfaces of the elongated board and between two adjacent unit boards for forming a V-shaped groove; breaking connecting parts between two ends of an elongated board and the frame; and breaking the V-groove connecting parts between two adjacent unit boardson the elongated board, thereby obtaining a unit board. The method according to the invention has advantages of reducing material consumption of adhesive tape and a process of manual adhesive tape applying and adhesive tape tearing, improving production efficiency and reducing production cost, and settling a problem of incapability of performing finished product cleaning on the small-dimension unit board.
Description
technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a small-size circuit board forming and processing method without internal positioning. Background technique [0002] The diameter of the traditional circuit board gong board positioning PIN nail in the industry is basically ≥0.8mm, the hole diameter is ≤0.8mm or the board size is small and there is not enough space to set the internal positioning hole. At this time, the external positioning of the circuit board cannot be produced by the internal positioning method. . Conventionally, the method of sticking tape on the surface of the circuit board is used to fix the small-sized unit board, and then the tape is torn off after the board is pressed; the other is to use the beer board method (stamping forming) to punch the board. In addition, due to the small size of the unit plate after molding, it cannot be cleaned by cleaning equipment normally, and the use...
Claims
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Login to View More IPC IPC(8): H05K3/00
CPCH05K3/0044H05K3/0052H05K3/0055H05K3/0097H05K2203/0228
Inventor 敖四超钟宇玲寻瑞平汪广明
Owner JIANGMEN SUNTAK CIRCUIT TECH