Diode chain-type packaging furnace

A diode and chain technology, applied in the field of diode packaging equipment, can solve the problems of substandard oxygen content, poor air tightness control, unstable transmission, etc., achieve continuous transmission, good product quality, and convenient temperature control operation Effect

Active Publication Date: 2018-06-12
合肥费舍罗热工装备有限公司
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Problems solved by technology

[0002] The chain-type packaging furnace is mainly used for sealing and metallizing the glass-encapsulated products of electronic components such as diodes and triodes in a protective atmosphere. If it does not meet the standard, the tempe

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  • Diode chain-type packaging furnace

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[0019] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] see figure 1 As shown, the present invention provides a diode chain packaging furnace, including a furnace body 1, an atmosphere control system, a temperature control system 3 and a transmission system 4, the furnace body 1 is provided with a straight opening 11, and the furnace body 1 includes sequentially arranged inlets T...

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Abstract

The invention provides a diode chain-type packaging furnace, and the furnace comprises a furnace body, an atmosphere control system, a temperature control system, and a transmission system. The furnace body is provided with a direct opening, and the furnace body comprises an inlet platform, an inlet transition segment, an inlet thermal preservation, a heating segment, an outlet thermal preservation segment, a cooling segment, an outlet transition segment, and an outlet platform. The inlet transition segment and the outlet transition segment are respectively provided with a transition packagingsteel sleeve, and the atmosphere control system comprises an atmosphere generation device, a temperature control device, a gas circuit control device and an exhaust gas channel. The temperature control system comprises a temperature control instrument, a K-thermocouple, and a temperature alarm system. The transmission system comprises a mesh belt conveying device and a variable frequency speed regulating device disposed on the temperature control instrument, and the mesh belt conveying device is disposed at the direct opening of the furnace body. According to the scheme of the invention, thenumber of leaking points of the whole furnace is reduced, and the oxygen content meets the technological requirements in the whole course. The furnace is good in temperature control effect, is stablein continuous transmission, is convenient to operate, and enables the quality of a product to be better.

Description

technical field [0001] The invention relates to the technical field of diode packaging equipment, in particular to a diode chain packaging furnace. Background technique [0002] The chain type packaging furnace is mainly used for the sealing and metallization of glass packaging products of electronic components such as diodes and triodes in a protective atmosphere. The existing chain type furnaces have poor air tightness control, so that the oxygen content in the whole process is required. If it does not meet the standard, the temperature control effect of the equipment is not good, resulting in low product quality. In addition, the traditional packaging furnace still has the phenomenon of unstable transmission, inconvenient operation, and low operation efficiency. SUMMARY OF THE INVENTION [0003] (1) Technical problems solved [0004] Aiming at the deficiencies of the prior art, the present invention provides a diode chain packaging furnace, which overcomes the deficien...

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Application Information

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IPC IPC(8): H01L21/67H01L21/56
CPCH01L21/56H01L21/67109
Inventor 王磊王峥方松徐洋
Owner 合肥费舍罗热工装备有限公司
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