Diode chain-type packaging furnace

Abstract

The invention provides a diode chain-type packaging furnace, and the furnace comprises a furnace body, an atmosphere control system, a temperature control system, and a transmission system. The furnace body is provided with a direct opening, and the furnace body comprises an inlet platform, an inlet transition segment, an inlet thermal preservation, a heating segment, an outlet thermal preservation segment, a cooling segment, an outlet transition segment, and an outlet platform. The inlet transition segment and the outlet transition segment are respectively provided with a transition packagingsteel sleeve, and the atmosphere control system comprises an atmosphere generation device, a temperature control device, a gas circuit control device and an exhaust gas channel. The temperature control system comprises a temperature control instrument, a K-thermocouple, and a temperature alarm system. The transmission system comprises a mesh belt conveying device and a variable frequency speed regulating device disposed on the temperature control instrument, and the mesh belt conveying device is disposed at the direct opening of the furnace body. According to the scheme of the invention, thenumber of leaking points of the whole furnace is reduced, and the oxygen content meets the technological requirements in the whole course. The furnace is good in temperature control effect, is stablein continuous transmission, is convenient to operate, and enables the quality of a product to be better.

Description

technical field [0001] The invention relates to the technical field of diode packaging equipment, in particular to a diode chain packaging furnace. Background technique [0002] The chain type packaging furnace is mainly used for the sealing and metallization of glass packaging products of electronic components such as diodes and triodes in a protective atmosphere. The existing chain type furnaces have poor air tightness control, so that the oxygen content in the whole process is required. If it does not meet the standard, the temperature control effect of the equipment is not good, resulting in low product quality. In addition, the traditional packaging furnace still has the phenomenon of unstable transmission, inconvenient operation, and low operation efficiency. SUMMARY OF THE INVENTION [0003] (1) Technical problems solved [0004] Aiming at the deficiencies of the prior art, the present invention provides a diode chain packaging furnace, which overcomes the deficien...

AI Technical Summary

Problems solved by technology

[0002] The chain-type packaging furnace is mainly used for sealing and metallizing the glass-encapsulated products of electronic components such as diodes and triodes in a protective atmosphere. If it does not meet the standard, the temperature control effect of the equipment is not good, which makes the product quality lower. In addition, the traditional packaging furnace also has problems such as unstable transmission, inconvenient operation, and low operating efficiency.

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