Bonding technology method for evanescent mould blocks

Abstract

The invention provides a bonding technology method for evanescent mould blocks. The bonding technology method comprises the steps that (1) bonding glue is prepared; (2) the evanescent mould blocks arebonded, specifically, the evanescent mould blocks are bonded into a combined evanescent mould with the complex structure through the bonding glue prepared in the step (1); (3) the surface of the evanescent mould assembly is scraped cleanly, specifically, the surface of the outer side of a connector of the bonded evanescent mould assembly in the step (2) is scraped cleanly; and (4) finally the bonded evanescent mould assembly is placed on a fixed frame in a shade place to be subjected to cold air drying. Ventages and cracks in the connection positions of the evanescent mould blocks can be reduced, and thus the smooth degree and connection strength of the connection positions of the evanescent mould blocks are improved; and preparation of the bonding glue is controlled to improve the fine degree and bonding force of the bonding glue, so that the bonding stability degree of the evanescent mould blocks is improved, bonding gaps in the bonding positions can be also reduced, and thus the pouring quality is improved.

Description

technical field [0001] The invention relates to the field of the processing technology of the lost foam, in particular to the improvement of the bonding process of the lost foam, and in particular to a bonding process method of the lost foam module. Background technique [0002] With the improvement of industrial level, people's production and processing level of lost foam is getting higher and higher, and they will soon enter into integrated mass production. In the existing technology, the adhesive connection of lost foam modules is due to When pouring the lost foam, it is replaced by metal after the lost foam is gasified and liquefied by high temperature, which requires relatively high smoothness of the lost foam surface, especially in the combination lost foam with a more complex structure, because it is necessary to When the module blocks are bonded, there will be leaks or cracks at the bonding interface, which will reduce the quality of the pouring and affect the produc...

AI Technical Summary

Problems solved by technology

[0002] With the improvement of the industrial level, people's production and processing level of the lost foam is getting higher and higher, and they will soon enter the integrated mass production. In the existing technology, the adhesive connection of the lost foam module is due to In the lost foam casting, it is replaced by metal after the lost foam is gasified and liquefied by high temperature, which requires relatively high smoothness of the lost foam surface, especially in the combination lost foam with complex structure, because it is necessary to When the module blocks are bonded, there will be leaks or cracks at the bonding interface, which will reduce the quality of the pouring and affect the production efficiency