An integrated circuit board integrated with a gas sensor
A gas sensor, integrated circuit board technology, applied in instruments, scientific instruments, material analysis by electromagnetic means, etc., can solve the problems of not meeting the trend of miniaturization, large size of devices, heavy weight, etc., to save raw materials, volume and the effect of quality reduction and sensitivity improvement
Active Publication Date: 2020-09-15
北京中凯达自动化工程有限公司
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Problems solved by technology
Such a setting, because it is equivalent to arranging two separate devices together, results in a larger volume and heavier weight of the device, which does not meet the current trend of miniaturization
Method used
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Embodiment Construction
[0039] figure 1 A schematic structure diagram of an integrated circuit board integrated with a gas sensor according to an embodiment of the present invention is shown. Such as figure 1 As shown, the integrated circuit board integrated with gas sensors includes: PCB board 10, which has a tank body 101; array gas sensors 20, which are formed on the bottom surface of the tank body 101 and arranged in an array The bottom surface; a conductive contact 30 formed at the bottom of the tank 101 for transmitting the electrical signal of the array gas sensor 20 to an external circuit; an air gap 40 formed on the upper part of the array gas sensor 20 , which is formed after the removal of the sacrificial layer on the upper part of the array gas sensor 20; the support frame 50 formed in the air gap 40; and the encapsulation layer 60, which is formed on the upper part of the support frame 50, and The encapsulation layer 60 has at least one vent hole 601 for introducing gas into the air ga...
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The invention provides an integrated circuit board integrated with a gas sensor. The integrated circuit board integrated with the gas sensor comprises a PCB (printed circuit board), an array gas sensor, a conductive contact, an air gap, a supporting frame and an encapsulation layer, wherein the PCB is provided with a groove body; the array gas sensor is formed on the bottom surface of the groove body and is arranged on the bottom surface in an array mode; the conductive contact is formed at the bottom of the groove body and is used for transmitting an electric signal of the array gas sensor toan external circuit; the air gap is formed in the upper part of the array gas sensor; the air gap is formed after a sacrificial layer on the upper part of the array gas sensor is removed; the supporting frame is formed in the air gap; the encapsulation layer is formed on the upper part of the supporting frame; furthermore, at least one vent hole is formed at the position of the encapsulation layer and is used for leading the gas in the air gap so as to contact with the array gas sensor. According to the scheme of the invention, the integrated circuit board integrates the gas sensor on the PCBof the integrated circuit board, so the raw materials are saved, the PCB is utilized to the utmost extent; furthermore, two devices are integrated into one device, so that the volume and the qualityare greatly reduced.
Description
technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an integrated circuit board integrated with a gas sensor. Background technique [0002] Integrated circuit boards can be divided into two categories: analog integrated circuit boards and digital ones, according to their functions and structures. Analog is used to generate, amplify and process various analog signals (referring to signals whose amplitude changes with time. For example, audio signals of semiconductor radios, tape signals of recorders, etc.), while digital is used to generate, amplify and process various digital signals (Refers to the signal with discrete values in time and amplitude. For example, the audio signal and video signal of VCD and DVD playback). [0003] Gas sensors can form independent classification standards from working principle, characteristic analysis to measurement technology, from materials used to manufacturing process, from detect...
Claims
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IPC IPC(8): G01N27/12
CPCG01N27/125
Inventor 胡静
Owner 北京中凯达自动化工程有限公司