A computer system and heat dissipation method for improving heat dissipation efficiency
A computer system, technology of heat dissipation efficiency, applied in computing, instrumentation, electrical digital data processing, etc., can solve the problem of low heat dissipation efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0078] refer to figure 1 As shown, a kind of computer system that improves heat dissipation efficiency provided by the present invention, this computer system comprises CPU and GPU, and wherein CPU is the processor chip of computer, and GPU is the graphics card chip of computer, and this system also comprises following parts;
[0079] The water tank 1 is used to store the medium water and to dissipate heat. It can also be connected to an air-cooled radiator separately to dissipate heat from the medium water. The water tank 1 generally adopts a closed water tank.
[0080] The first water pump 2 is used to drive medium water circulation; the first water pump 2 can use a variable flow pump, and the control valve group 5 can also adjust the flow of the flow pump according to the CPU heat and GPU heat, thereby changing the CPU cooling box 3 and GPU cooling box 4 The heat dissipation speed of the chip.
[0081] The CPU cooling box 3 is used for water cooling and heat dissipation of...
Embodiment 2
[0115] refer to Figure 4 As shown, in another preferred embodiment of the present invention, the control valve group 5 includes a first two-position four-way valve 52, a second two-position four-way valve 53 and a three-position six-way valve 55, the first The two-position four-way valve 52, the second two-position four-way valve 53 and the three-position six-way valve 54 are all electrically connected to the control device 8;
[0116] Port P of the first two-position four-way valve 52 communicates with the first water pump 2, port T of the first two-position four-way valve 52 communicates with the water tank 1, and port A of the first two-position four-way valve 52 communicates with the CPU for heat dissipation. The first interface 31 of the box 3 is connected, and the B port of the first two-position four-way valve 52 is connected with the second interface 32 of the CPU cooling box 3;
[0117] Port P of the second two-position four-way valve 53 communicates with the first ...
Embodiment 3
[0126] refer to Figure 5 to Figure 7 As shown, the CPU cooling box 3 includes a box body 33, a box cover 34, a first interface 31, and a second interface 32. The middle part of the box body 33 has a cooling area 331, and the two sides of the cooling area 331 are respectively provided with a second A distribution area 332 and a second distribution area 333, the cross-sectional shapes of the first distribution area 332 and the second distribution area 333 are triangles, and the first distribution area 332 and the second distribution area 333 of the triangle have inlet ports 334 and the outlet end 335, the cross-sectional area along the direction from the inlet end 334 to the outlet end 335 decreases successively. The heat dissipation area 331 is provided with a plurality of heat dissipation plates 35 arranged in parallel, and flow chambers are formed between adjacent heat dissipation plates 35 36, the flow chamber 36 communicates with the first distribution area 332 and the sec...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More