Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of led chip, preparation method and led chip

A technology of LED chips and substrates, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of short life, poor heat dissipation, junction temperature, and poor heat dissipation effect.

Active Publication Date: 2020-01-31
YANGZHOU CHANGELIGHT
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the LED chip emits light, it also generates heat. This is because the electric energy added to the LED chip is not all converted into light energy, but part of it is converted into heat energy. The speed conducts the heat away, otherwise a high junction temperature will be generated, and the light decay or life of the LED chip is directly related to its junction temperature. If the heat dissipation is not good, the junction temperature will be high and the life will be short. Heat dissipation has become one of the concerns of LED chip researchers
[0004] At present, after the LED chip is packaged, the substrate can only be connected with the support, and the junction temperature generated on the substrate is transmitted to the outside through the support. The heat dissipation effect mainly depends on the support, resulting in poor heat dissipation effect.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of led chip, preparation method and led chip
  • A kind of led chip, preparation method and led chip
  • A kind of led chip, preparation method and led chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Embodiment 1 of the present application provides an LED chip, such as figure 1 What is shown includes: a substrate 101 , an epitaxial layer 102 and a first electrode layer 103 sequentially formed on the substrate 101 , and a heat conducting layer 104 formed on the back of the substrate 101 .

[0047] In the embodiment of the present application, the substrate 101 can be selected from sapphire, gallium arsenide and the like.

[0048]The epitaxial layer 102 includes an N-type layer, a light-emitting layer, and a P-type layer (not shown in the figure) sequentially formed on the substrate 101, and one side of the first electrode layer 103 and the epitaxial layer 102 is etched to expose the N-type layer, A second electrode layer 105 is formed on the exposed N-type layer.

[0049] The first electrode layer 103 is used to connect to the positive pole of the power supply; the second electrode layer 105 is used to connect to the negative pole of the power supply.

[0050] The ...

Embodiment 2

[0067] Embodiment 2 of the present application provides a method for preparing an LED chip, the flow chart is as follows Figure 5 As shown, the specific steps are as follows:

[0068] S200, forming an epitaxial layer on the substrate, where the epitaxial layer includes an N-type layer, a light-emitting layer, and a P-type layer sequentially formed on the substrate.

[0069] Such as Figure 6 As shown, an epitaxial layer 102 is formed on a substrate 101 , and the epitaxial layer includes an N-type layer 1021 , a light-emitting layer 1022 and a P-type layer 1023 formed on the substrate 101 in sequence.

[0070] S210, forming a first electrode layer on the P-type layer, where the first electrode layer is used to connect to a positive electrode of a power supply.

[0071] Wherein, in step S210, forming the first electrode layer on the P-type layer includes:

[0072] Such as Figure 7 As shown, a transmissive electrode layer 1031 is formed on the P-type layer 1023, and a P-typ...

Embodiment 3

[0090] Embodiment 3 of the present application proposes an LED wafer, including the LED chip proposed in Embodiment 1.

[0091] Compared with the prior art, the LED chip proposed in the embodiment of the present application includes: a substrate, an epitaxial layer and a first electrode layer sequentially formed on the substrate, and a heat conduction layer formed on the back of the substrate; The epitaxial layer includes an N-type layer, a light-emitting layer, and a P-type layer sequentially formed on the substrate, and one side of the first electrode layer and the epitaxial layer is etched to expose the N-type layer. A second electrode layer is formed on the exposed N-type layer; the first electrode layer is used to connect to the positive pole of the power supply; the second electrode layer is used to connect to the negative pole of the power supply; the back of the substrate is provided with multiple The heat dissipation groove embedded in the substrate; the heat conducti...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an LED chip, a preparation method and an LED chip. The LED chip comprises a substrate, an epitaxial layer and a first electrode layer which are formed on the substrate in sequence, and a heat conducting layer formed on the back of the substrate, wherein the epitaxial layer comprises an N-type layer, a luminescent layer and a P-type layer which are formed on the substrate insequence, one side of the first electrode layer and one side of the epitaxial layer are etched to expose the N-type layer, and a second electrode layer is formed on the exposed N-type layer; the firstelectrode layer is used for connecting a power supply positive pole; the second electrode layer is used for connecting a power supply negative pole; a plurality of heat dissipation grooves embedded into the substrate are formed in the back of the substrate; and the heat conducting layer is filled with the heat dissipation grooves. Through the embodiment, the heat conducting layer is arranged on the back of the substrate, so that the heat dissipation performance of the LED chip is improved.

Description

technical field [0001] The present application relates to the technical field of optoelectronic devices, in particular, to an LED chip, a preparation method and an LED chip. Background technique [0002] The light-emitting principle of light-emitting diodes (LEDs) is to use the energy difference between electrons moving between n-type semiconductors and p-type semiconductors to release energy in the form of light. This light-emitting principle is different from that of incandescent lamps, so light-emitting diodes are used called a cold light source. In addition, light-emitting diodes have the advantages of high durability, long life, light weight, and low power consumption. Therefore, today's lighting market places high expectations on light-emitting diodes and regards them as a new generation of lighting tools. [0003] However, when the LED chip emits light, it will also generate heat. This is because the electric energy added to the LED chip is not completely converted i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H01L33/00
CPCH01L33/005H01L33/641H01L33/642H01L2933/0075
Inventor 贾钊赵炆兼张双翔杨凯陈凯轩
Owner YANGZHOU CHANGELIGHT