A multi-frequency antenna device

Abstract

The invention provides a multi-frequency antenna device comprising a first metal layer, a second metal layer, a ground layer, and dielectric substrates positioned between the metal layers and betweenthe metal layer and the ground layer, wherein a metamaterial layer is arranged between the first metal layer and the second metal layer. According to the multi-frequency antenna device, the problem ofcontradiction among high gain, small interference and small size, which is difficult to overcome, in a traditional stacked antenna preparation method is solved, the extremely good frequency band isolation property is achieved via flexible and ingenious arrangement of the antenna wiring and the coupled isolation unit; the metamaterial unit is arranged between the two antenna metal layers, so thatthe antenna size is further reduced and the isolation between high frequency and low frequency is enhanced via the special conduction property of the metamaterial.

Description

technical field [0001] The invention belongs to the field of communication antennas, and more specifically relates to a multi-frequency antenna device for smart equipment. Background technique [0002] With the rapid development of wireless communication, antennas play a more important role in wireless communication smart device products. Today, as mobile devices have become an indispensable item in people's lives, it has also led to the vigorous development of the communication industry. Because of this, various small antennas have been developed and widely used in various For mobile devices, for example, planar inverted-F antennas, monopole antennas, stereo antennas, etc. However, the above-mentioned antennas of the known art have many disadvantages. [0003] For example, the structure of the planar inverted-F antenna is relatively complicated, and because the planar inverted-F antenna is a three-dimensional antenna, the additional mold cost and assembly cost lead to hig...

AI Technical Summary

Problems solved by technology

However, the antennas of the above-mentioned known technologies have many disadvantages

[0003] For example, the structure of the planar inverted-F antenna is relatively complicated, and because the planar inverted-F antenna is a three-dimensional antenna, the additional mold cost and assembly cost lead to high cost, and the commercial cost is too high, and its commercial competitiveness will decrease. will reduce

The three-dimensional antenna is too large to be placed in the increasingly smaller mobile devices. If the three-dimensional antenna is forcibly reduced in size to achieve miniaturization, it will easily lead to a decline in antenna performance.

Especially in the field of multi-frequency antennas, the small size often causes coupling interference between frequency bands. How to take into account miniaturization while ensuring interference between different frequency bands has always been a difficult problem for people.

[0004] Therefore, how to propose a multi-frequency antenna, which can effectively improve the problems of complex structure, high cost, and poor isolation performance of conventional antennas, has become urgent.

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