An insulating substrate with a spiral heating electrode

Abstract

The invention provides an insulation substrate with a spiral heating electrode. The insulation substrate comprises two parts which can be independently separated and have same structure, wherein mainbody materials of the two parts in the insulation substrate are insulation materials, each insulation material comprises a half-spiral metal ring, a spiral metal coil is formed between the half-spiralmetal rings when the two parts are laminated, a cavity of the insulation substrate is formed between two grooves, the spiral metal coil is used as a heating coil and is simultaneously used as an inductor of a circuit, the inductor is used for detecting a changing magnetic field and is connected with a controller, so that control of a device in the cavity is achieved by the changing magnetic field, and the problem of heating a current insulation substrate is solved; and the substrate is heated by the coil, meanwhile, the heating coil is used as the inductor, an inductance effect and a heatingeffect are achieved, the two functions are combined so as to reduce the number of parts, and miniaturization is achieved.

Description

technical field [0001] The invention belongs to the technical field of device manufacturing, in particular to an insulating substrate with a spiral heating electrode. Background technique [0002] Traditional gas sensor packaging technologies mainly include TO packaging, DIP ceramic socket packaging, etc., but the main problem of the above packaging structure is that the substrates are all metal and ceramic materials with high thermal conductivity, and the substrate materials with high thermal conductivity lead to The heat that keeps the chip working is dissipated through the substrate and various contact parts, resulting in increased power consumption of the sensor, and the stabilization time required for heating to the working temperature is longer, which brings many problems to the practical application of the gas sensor. Therefore, the effect of heating technology on the performance indicators of hydrogen sensors is extremely significant. [0003] The existing heating t...

AI Technical Summary

Problems solved by technology

[0002] Traditional gas sensor packaging technologies mainly include TO packaging, DIP ceramic socket packaging, etc., but the main problem of the above packaging structure is that the substrates are all metal and ceramic materials with high thermal conductivity, and the substrate materials with high thermal conductivity lead to The heat that keeps the chip working is dissipated through the substrate and various contact parts, resulting in increased power consumption of the sensor, and a longer stabilization time for heating to the working temperature, which brings many problems to the practical application of gas sensors

Therefore, the effect of heating technology on the performance indicators of hydrogen sensors is extremely significant

[0003] The existing heating technology is mainly realized by selecting heat insulating materials or heating components. For example, the sensor chip is suspended on the upper part of the base through multiple leads, and the chip and the package base are separated by air. However, this The packaging structure requires a large number of leads to ensure the reliability of the structure. On the one hand, the volume of the sensor increases, and on the other hand, a large amount of heat is dissipated through the leads.

In practice, the heating effect of this insulation structure is not significant

[0004] In the field of gas sensing, gas sensors need to be heated in many cases, and heating electrodes are usually set up, but these electrodes need to be additionally set up, occupying a certain space in volume, which hinders the miniaturization of the device. Therefore, how to reasonably distribute the heating electrodes is what those skilled in the art have been doing. In addition, setting the opening and control circuits separately will also greatly hinder the miniaturization of the device. Therefore, it is necessary to improve this in structure

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