5results about How to "Fix Heating Problems" patented technology

This invention relates to a heating control system for molds, and more particularly to a heating control system and method for multiple layers inside and outside a mold. The heating control system is installed on a molding press and a mold temperature controller. The heating control system includes upper and lower layer heating control systems, an inner layer heating control system, and an outer middle layer heating control system. The molding press also includes a human-machine interface, a temperature controller, a programmable logic controller (PLC), a transformer, and a thyristor power regulator. The PLC establishes signal connections with the temperature controller, the mold temperature controller, and a platinum resistance thermometer (PTT). The temperature controller is connected to the mold temperature controller via the PTC to form a closed-loop system. A closed-loop control system is formed between the temperature controller and the PTC. By using a temperature controller, a thyristor, and a PTC, along with upper and lower heating plates, a middle heating blanket, and an inner layer heating tower, the problem of strict temperature control on the inner and outer surfaces and upper, middle, and lower layers of large molds in a molding press is solved, temperature control accuracy is improved, and the heating problem for irregularly shaped products is addressed.

Example systems, apparatuses, and techniques are disclosed. An example implantable medical device (IMD) includes: a power source; a receiving antenna configured to receive an induced current from the wireless power transfer system; and a power control circuit coupled to the power source and the receive antenna, the power control circuit configured to power operation of the IMD from at least one of the power source or the induced current. The IMD includes processing circuitry coupled to the power control circuitry. The processing circuitry is configured to: control the power control circuitry to power operation of the IMD from the power source; determining the presence of an induced current; and control the power control circuit to power at least one high power operation of the IMD from the induced current based on the presence of the induced current.

The application relates to a horn related technical field, in particular to a welding line heating device for horn production, which comprises a workbench, a temperature detector is installed on the upper surface of the workbench, and a heating mechanism is arranged on the upper surface of the workbench. The welding line heating device for horn production, the first sliding plate below the right heat preservation shell slides the first sliding groove, the right heat preservation shell is slid to the inside of the supporting plate, the second sliding groove on one side of the left heat preservation shell is slid to the second sliding plate, so that the left heat preservation shell is fixed with the right heat preservation shell, the first sliding plate below the left heat preservation shell slides the first sliding groove, so that the left heat preservation shell is slid to the inside of the supporting plate, the heating rod is started, the welding line is heated, then the temperature detector detects the internal temperature of the left heat preservation shell and the right heat preservation shell, and finally the temperature controller controls the internal temperature of the left heat preservation shell and the right heat preservation shell.

The invention relates to a reagent temperature control device and method, and relates to the technical field of digital microfluidics, the reagent temperature control device comprises a digital microfluidics unit, a temperature control unit and at least one power unit, the digital microfluidics unit is provided with a reaction chamber; the temperature control unit is connected with the digital micro-fluidic unit and is provided with at least one temperature control flow channel communicated with the reaction chamber, and the temperature control unit is configured to heat or cool liquid drops in the temperature control flow channel; the power unit is configured to move the liquid drops from the reaction chamber to the temperature control flow channel or move the liquid drops from the temperature control flow channel to the reaction chamber. Compared with the prior art, the problem of reagent heating can be effectively solved, the independently arranged temperature control unit is higher in heating efficiency and shorter in heating time, and the temperature consistency of liquid drops is better. And meanwhile, the problem that the pipetting performance of the chip is reduced due to the fact that the reagent is adhered to the surface of the digital micro-fluidic chip during heating is solved.