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Broadband impedance matching module and device containing the same

An impedance matching and impedance matching network technology, applied in impedance networks, electrical components, electronic switches, etc., can solve the problems of inability to adjust the circuit, lack of flexibility, poor inductance quality factor, etc., to reduce product design complexity and save matching. Circuit area and the effect of improving development efficiency

Pending Publication Date: 2018-06-29
RADROCK (SHENZHEN) TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor quality factor of the inductance in the high frequency band, the insertion loss of the matching network alone is close to about 1dB (decibel)
At the same time, the matching module lacks flexibility and cannot adjust the circuit in practical applications

Method used

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  • Broadband impedance matching module and device containing the same
  • Broadband impedance matching module and device containing the same
  • Broadband impedance matching module and device containing the same

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Embodiment Construction

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, various implementation modes of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that, in each implementation manner of the present invention, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in this application can also be realized.

[0026] The first embodiment of the present invention relates to a broadband impedance matching module, which is used to form an impedance matching network, and is suitable for impedance matching in various application scenarios such as active and passive, such as power amplifiers in active devices, low-noise ...

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Abstract

Embodiments of the invention relate to the technical field of radio frequency impedance matching, and disclose a broadband impedance matching module and a device containing the same. The broadband impedance matching module comprises: an impedance matching network, M radio frequency (RF) switches, and an impedance matching device connected to each of the RF switches; wherein M is a natural number greater than or equal to 1; the M RF switches and the impedance matching device connected to each of the RF switches are all connected to the impedance matching network; the RF switches are all used toconnect to a control unit, and connect or disconnect the impedance matching device connected to each of the RF switches to or from the impedance matching network under the control of the control unit, so as to adjust the matching impedance of the broadband impedance matching module. By adopting the embodiments provided by the invention, the matching impedance can be adjusted according to actual needs, so that certain versatility is acquired, which is beneficial for improving the development efficiency of the RF front-end product.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of radio frequency impedance matching, and in particular to a broadband impedance matching module and a device including the same. Background technique [0002] With the rapid development of communication technology, people have higher and higher requirements for communication speed. However, with the rise of frequency and the difficulty of system-level design brought about by complex communication systems, new challenges are brought to RF chips. For example, in the design of 5Gsub-6GHz RF chips, due to its broadband characteristics, it is necessary to be able to perform broadband matching on RF matching. In order to achieve the matching between high and low impedance, passive inductors and capacitors can be used for matching design, and the wide bandwidth is mainly through multi-level networks. Please refer to Figure 1a to Figure 1c Two levels of matching are shown, in order to achi...

Claims

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Application Information

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IPC IPC(8): H03H7/38H03K17/693
CPCH03H7/38H03K17/693
Inventor 倪建兴
Owner RADROCK (SHENZHEN) TECH CO LTD
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