Ultrasonic linear phase array transducer for piezoelectric ceramics, and preparation method thereof

Abstract

The invention relates to an ultrasonic linear phase array transducer for piezoelectric ceramics, and a preparation method thereof. The preparation method comprises the steps of cutting a piezoelectricceramic substrate into multiple transducer array elements so as to form a transducer array, wherein the width of each transducer array element and an interval between each two adjacent transducer array elements are 20 to 100mum, and the cutting depth is 50 to 300mum; cutting one side of the transducer array to obtain a bottom electrode coplane electric connection trough, wherein the width of thebottom electrode coplane electric connection trough is 20 to 300mum; filling adhesives among the transducer array elements, and filling a conductive adhesive into the bottom electrode coplane electricconnection trough; preparing a bottom electrode; thinning the thickness of a piezoelectric ceramic surface opposite to the bottom electrode, and reducing the thickness of the piezoelectric ceramic tobe 50 to 200mum; preparing a connecting surface of an upper electrode and the bottom electrode; dividing the transducer array to form multiple single ultrasonic linear phase array transducers; lead bonding the transducers; and sealing and filling a matching layer. The transducer provided by the invention is high in detection resolution, large in detection depth, and capable of being used for ultrasonic detection of a microscale feature structure.

Description

technical field [0001] The invention relates to the technical field of preparation of ultrasonic linear phased array transducers in ultrasonic detection technology, in particular to a piezoelectric ceramic ultrasonic linear phased array transducer for measuring micro-scale features and a preparation method thereof. Background technique [0002] The use of ultrasonic phased array detection methods began in the 1960s, and has been widely used in the fields of medical ultrasonic imaging and medical diagnosis. This is mainly due to its advantages in sound field control and focusing, and electronic scanning speed. The emitted sound beam is focused and deflected by electronic control, so that the ultrasonic wave can irradiate various areas of the object to be inspected, and then it is detected by phase control. A clear and uniform high-resolution acoustic imaging of the object can be obtained by performing various key technologies such as focusing, variable aperture, and apodizati...

AI Technical Summary

Problems solved by technology

Its main disadvantage is that the process is complicated, and usually requires silicon micromachining processes such as bonding and deep silicon etching. Due to the limitation of silicon technology, piezoelectric film materials usually use AlN film and other materials with low piezoelectric coefficient and electromechanical conversion efficiency. , which has a great influence on key indicators such as microstructure detection depth

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