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A sensor device with reference capacitance and its manufacturing method

A sensor device and reference capacitor technology, applied in the sensor field, can solve the problems of unfavorable package integration, large sensor heat radiation, etc., and achieve the effect of improving heat dissipation efficiency and avoiding parasitic capacitance problems.

Active Publication Date: 2020-01-21
嘉善品智联科技有限公司
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  • Description
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AI Technical Summary

Problems solved by technology

[0004] For sensors, a reference capacitor is generally used for reference, and this purpose is often achieved by connecting a separate capacitor externally, which is not conducive to the integration of the package, and the sensor itself has a large thermal radiation, and it is necessary to quickly dissipate heat from the package shed

Method used

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  • A sensor device with reference capacitance and its manufacturing method
  • A sensor device with reference capacitance and its manufacturing method
  • A sensor device with reference capacitance and its manufacturing method

Examples

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Embodiment Construction

[0033] refer to Figure 7 , the sensor device with reference capacitance of the present invention, it comprises:

[0034] A substrate 1, said substrate 1 comprising a front side with a semiconductor element 2, a back side opposite to said front side, and sides perpendicular to said front side and back side;

[0035] In the groove 7 on the back side of the substrate 1, the depth of the groove 7 is less than or equal to half of the thickness of the substrate 1, and the bottom surface of the groove 7 has a plurality of strip-shaped grooves evenly arranged Road 8;

[0036] A plurality of sheet-shaped conductive fins 9, the ends of the sheet-shaped conductive fins 9 are inserted into the strip-shaped channel 8, and protrude from the groove 7;

[0037] A plurality of first pads 3 on the front side of the substrate 1 and wiring layers 10 on both sides of the groove 7 on the back side of the substrate 1, and the wiring layers 10 are respectively electrically connected to the The tw...

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Abstract

The invention provides a sensor device with a reference capacitor and a manufacturing method thereof. Integrated packaging of the reference capacitor is realized by using sheet-like conducive fins, and adjustable capacitance value of the reference capacitor is realized by using the quantity of the sheet-like conductive fins; a groove with a bar-type channel is the foundation of heat dissipation, and secondary heat dissipation is carried out by using the sheet-like conductive fins, so that the heat dissipation efficiency is improved to the maximum extent; and a second bonding pad is formed on the side face, so that the problem of larger stray capacitance, generated when a back face is formed, of the bonding pad can be avoided.

Description

technical field [0001] The invention relates to the field of sensors, in particular to a sensor device with a reference capacitance and a manufacturing method thereof. Background technique [0002] The simplest electronic device in the photosensitive sensor is the photoresistor, which can sense the light and dark changes of the light, output a weak electrical signal, and control the automatic switch of the LED lamp through simple electronic circuit amplification. Therefore, it is widely used in automatic control and household appliances. For remote lighting fixtures, such as: automatic brightness adjustment in TVs, automatic exposure in cameras; Stop device and anti-theft alarm device Medium [0003] Photosensitive sensor is one of the most common sensors. It has a wide variety, mainly including: photocell, photomultiplier tube, photoresistor, phototransistor, solar cell, infrared sensor, ultraviolet sensor, fiber optic photoelectric sensor, color sensor, CCD and CMOS imag...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/02H01L31/0203H01L31/024H01L31/18
CPCH01L31/02002H01L31/0203H01L31/024H01L31/18Y02P70/50
Inventor 孙培丽
Owner 嘉善品智联科技有限公司
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