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127results about How to "Avoid Parasitic Capacitance" patented technology

Array substrate, display and electronic equipment

The invention discloses an array substrate, a display and electronic equipment. The array substrate comprises a public electrode layer and a pixel electrode layer which are opposite to each other, wherein the pixel electrode layer comprises a plurality of arrayed pixel electrodes, and the public electrode layer comprises a plurality of public electrode blocks; the array substrate further comprises a plurality of switch devices, a plurality of data lines extending along the column direction of the array, and a plurality of public routings electrically connected with the public electrode blocks in a one-to-one correspondence manner; projections of the public routings in the pixel electrode layer are not superposed with the pixel electrodes in the direction vertical to the pixel electrode layer; a pixel clearance is reserved between every two adjacent pixel electrodes; projections of the public routings in the pixel electrode layer and projections of the data lines in the pixel electrode layer are positioned in different pixel clearances in the direction vertical to the pixel electrode layer; two data lines of which the projections are positioned in the same pixel clearance are positioned on different layers. The array substrate is higher in touch detection precision.
Owner:SHANGHAI TIANMA MICRO ELECTRONICS CO LTD +1

Three-dimensional NAND memory device structure and preparation method thereof

The invention provides a three-dimensional NAND memory device structure and a preparation method thereof. The method comprises the following steps: forming a first laminated structure and a second laminated structure with communicated channel holes on a support substrate; forming a functional layer, a channel layer and a filling dielectric on the surface of the channel hole; forming a gate gap; filling a gap insulating layer in the gate gap; removing the support substrate, and forming a third laminated structure on the back surface of the first laminated structure; etching the third laminatedstructure to form a first etching window, and removing the functional layer at the bottom of the first channel hole based on the first etching window; and filling a channel connection layer in the first etching window. The channel connection layer is formed at the corresponding position of the back surface of the channel hole, so that the risk that the functional layer at the connecting part of the upper channel hole and the lower channel hole is damaged when the channel connection layer and the channel layer are connected through a process of punching from the front surface of the channel hole is avoided; and in addition, the process for forming the channel connection layer is low in complexity, easy to control and high in yield.
Owner:YANGTZE MEMORY TECH CO LTD

Fin type field effect transistor and manufacture method thereof

The invention provides a fin type field effect transistor and a manufacture method of the fin type field effect transistor. The method comprises the steps that a fin is formed on a semiconductor substrate, a virtual grid electrode is formed on the semiconductor substrate with the formed fin and stretches across the fin, first side walls are formed on two sides of the virtual grid electrode, ions are implanted in the fin so as to form a source electrode and a drain electrode of the fin type field effect transistor, the virtual grid electrode is eliminated, an opening is formed in the position of the virtual grid electrode, a high-K-grid medium layer and a metal grid electrode material layer are sequentially deposited so as to fill the opening, and a metal grid electrode is formed, and the first side walls and the high-K-grid medium layer on the side wall of the metal grid electrode are eliminated. According to the fin type field effect transistor, the high-K-grid medium layer on two sides of the metal grid electrode are effectively eliminated in sequence, stray capacitance is prevented from generating between the metal grid electrode and the source electrode or the drain electrode, other semiconductor structures are prevented from being damaged during the eliminating process, and the fin type field effect transistor is enabled to be good in electrical properties.
Owner:SEMICON MFG INT (SHANGHAI) CORP

Array substrate and preparation method therefor, display panel and display apparatus

The invention discloses an array substrate and a preparation method therefor, a display panel and a display apparatus, and belongs to the display field. The array substrate comprises multiple pixel units, a reading signal line, a first gate electrode signal line, a second gate electrode signal line, a data line and a shielding signal line, wherein each pixel unit comprises three sub pixel units; each sub pixel unit comprises a display sub unit; at least one pixel unit also comprises a palmprint recognition sub unit; the shielding signal line is parallel to the reading signal line; one end of the shielding signal line is grounded while the other end of the shielding signal line is connected with the input end of the first gate electrode signal line; the corresponding display sub units are connected with the first gate electrode signal line and the data line; and the palmprint recognition unit is connected with the second gate electrode signal line and the reading signal line. According to the array substrate, due to the addition of the shielding signal line, the interference on the reading signal line from the grid electrode signal lines can be reduced, stray capacitance can be prevented from being generated on the reading signal line, and the palmprint recognition effect is improved.
Owner:BOE TECH GRP CO LTD +1
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