Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for preparing high temperature-resistant copper-clad laminate glue solution

A technology for copper clad laminates and high heat resistance, applied in the field of copper clad laminate preparation, can solve the problems of sheet material explosion, layered foaming, affecting the heat resistance of copper clad laminates, etc., and achieve the effect of sufficient response

Inactive Publication Date: 2018-07-20
江门建滔积层板有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Gluing on wood pulp fiber insulating paper to prepare insoluble and infusible prepreg glue is the key to affecting the heat resistance of copper clad laminates. Copper clad laminates prepared by using traditional copper clad laminate glue have been processed Repeated lead-free reflow soldering is prone to layered blistering and sheet explosion

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The specific embodiment of the present invention is described further below:

[0018] A method for preparing high heat-resistant copper-clad laminate glue, characterized in that the preparation raw materials include the following components in parts by weight:

[0019] Bismaleimide modified epoxy phenolic resin: 45.4%;

[0020] Low bromine resin: 10%; base resin: 6%; high bromine resin: 8%; curing accelerator: 0.1%; antimony trioxide: 0.8%; triphenyl phosphate: 4%; kaolin: 9.5%; acetone: 6.0%; solvent: 7.0%; curing agent: 3.2%.

[0021] The preparation process of the high heat-resistant copper-clad laminate glue comprises the following steps:

[0022] (1) Weigh bismaleimide-modified epoxy phenolic resin, low-bromine resin, base resin, high-bromine resin, acetone, and solvent, and pump them into a high-speed shear tank;

[0023] (2) Weigh the formula amount of curing accelerator, antimony trioxide, triphenyl phosphate and kaolin respectively, and add them into the hig...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for preparing a high temperature-resistant copper-clad laminate glue solution. Raw materials for preparing the high temperature-resistant copper-clad laminate glue solution comprise, by weight, 45.4% of bismaleimide modified epoxy phenolic resin, 10% of low-bromine resin, 6% of base resin, 8% of high-bromine resin, 0.1% of a curing accelerator, 0.8% of antimony trioxide, 4% of triphenyl phosphate, 9.5% of kaolin, 6.0% of acetone, 7.0% of a solvent and 3.2% of a curing agent. The high temperature-resistant copper-clad laminate glue solution obtained by the preparation method can be used for producing a high temperature-resistant copper-clad laminate in order to solve the problems of layering, foaming and plate cracking of copper-clad laminate during lead-freereflow soldering.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminate preparation, in particular to a method for preparing a high-heat-resistant copper-clad laminate glue. Background technique [0002] In the production and manufacture of automotive PCB boards, it is necessary to perform multiple long-term lead-free reflow soldering on copper clad laminates, and the required maximum temperature is between 260°C and 270°C for 3 to 5 reflow soldering and one wave soldering Therefore, the requirements for solder resistance of copper clad laminates are getting higher and higher. In the preparation of traditional copper clad laminates, thermosetting phenolic resins are used for crosslinking and addition reactions with epoxy resins under the action of curing agents and curing accelerators. Generate a body-shaped network thermosetting epoxy phenolic resin, then add traditional dicyandiamide to the epoxy phenolic resin for curing, add other accelerators and fil...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/14C08L101/00C08K13/02C08K3/22C08K5/523C08K3/34
Inventor 贺卫民
Owner 江门建滔积层板有限公司