Improved full-automatic semiconductor material grinding device

Abstract

The invention discloses an improved full-automatic semiconductor material grinding device. The device comprises a grinding rack which is fixedly mounted on the right end surface of a movable manipulator, wherein a transmission chamber and a telescoping chamber which passes through the lower end surface of the grinding rack are arranged in the inner wall body of the grinding rack; a guide chamber is formed between the transmission chamber and the telescoping chamber; a rotating chamber is arranged in the inner wall body, on the top part of the telescoping chamber, of the grinding rack; a rotating rod is arranged on the top part of the transmission chamber in a leftward-rightward extending manner, and the rotating rod is connected to the left side end wall and the right side end wall of thetransmission chamber in a rotating fitting manner; a rotating motor is connected to the extending end of the left side of the rotating rod; the outer surface of the rotating motor is fixedly mounted into the inner wall body of the grinding rack; the right side of the rotating rod extends into the rotating chamber, and a first bevel gear is fixedly mounted at the tail end of the rotating rod. Withthe adoption of the device, a semiconductor material can be rotatably grinded through rotary grinding wheel, and meanwhile, the rotary grinding wheel can swing up and down to perform grinding, so that the grinding efficiency is high.

Description

technical field [0001] The invention relates to the technical field of semiconductor material processing, in particular to an improved fully automatic semiconductor material grinding equipment. Background technique [0002] Semiconductor materials are a class of materials with semiconducting properties, which can be used to make semiconductor devices and electronic materials for machine tool circuits. No matter from the perspective of technology or economic development, the importance of semiconductors is very huge, so the application is very important. Widely, during the manufacturing process of semiconductor materials, the surface needs to be ground. The current grinding equipment for semiconductor materials has low grinding efficiency. Therefore, an efficient grinding equipment for semiconductor materials is needed. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an improved fully automatic semiconductor mater...

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Problems solved by technology

[0002] Semiconductor materials are a class of materials with semi-conductive properties, which can be used to make semiconductor devices and electronic materials for machine tool circuits. No matter from the perspective of technology or economic development, the importance of semiconductors is very huge, so the application is very important. Widely, during the production and manufacturing process of semiconductor materials, the surface needs to be ground. At present, the grinding equipment for semiconductor materials has low grinding efficiency. Therefore, an efficient grinding equipment for semiconductor materials is needed.

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