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Semiconductor packaging device

A technology for packaging devices and semiconductors, which can be used in semiconductor devices, assembling microstructure devices, measuring devices, etc., and can solve the problems of complex semiconductor devices.

Active Publication Date: 2019-09-06
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Semiconductor devices are becoming increasingly complex, driven at least in part by demands for smaller dimensions and enhanced processing speeds

Method used

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  • Semiconductor packaging device
  • Semiconductor packaging device
  • Semiconductor packaging device

Examples

Experimental program
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Embodiment Construction

[0018] Figure 1A Illustrated is a semiconductor package structure 1A according to some embodiments of the invention. The semiconductor package structure 1A includes a carrier 10 , a MEMS 11 , an electronic component 12 and a ring structure 13 .

[0019] The carrier 10 may be, for example, a printed circuit board, such as a paper copper foil laminate, a composite copper foil laminate or a polymer-impregnated fiberglass-based copper foil laminate. The carrier 10 may contain interconnect structures such as redistribution layers (RDL) or ground elements. The carrier 10 has a surface 101 and a surface 102 opposite to the surface 101 . In some embodiments, the surface 101 of the substrate is referred to as the top surface or first surface, and the surface 102 of the substrate is referred to as the bottom surface or second surface. The carrier 10 includes conductive pads 10p1 on its top surface 101 and conductive pads 10p2 on its bottom surface 102 to provide electrical connection...

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Abstract

The invention relates to a semiconductor packaging device. The semiconductor packaging device includes a carrier, a first MEMS and a first electronic component. The carrier has a first surface and a second surface opposite the first surface. The MEMS is disposed in the carrier. The first MEMS is exposed from the first surface of the carrier and exposed from the second surface of the carrier. The first electronic component is disposed on the first surface of the carrier and is electrically connected to the first MEMS.

Description

technical field [0001] The present invention relates to semiconductor packaging devices, and more particularly, to semiconductor packaging devices including microelectromechanical systems (MEMS). Background technique [0002] MEMS (as used herein, the term "MEMS" may be used to refer to a single microelectromechanical system or multiple microelectromechanical systems) are widely used in semiconductor devices to detect signals (e.g., sound, movement / motion, pressure, gas, humidity, temperature and the like) and transform the detected signal into an electrical signal. Semiconductor devices have become increasingly complex, driven at least in part by demands for smaller dimensions and increased processing speeds. At the same time, there is a demand for further miniaturization of many electronic products incorporating these semiconductor devices. In some cases it may be desirable to reduce the space occupied by MEMS on the substrate of a semiconductor device, and to simplify a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/00B81B7/02
CPCB81B7/0077B81B7/02B81C1/00238B81B2201/0278B81C2203/0792B81B2201/0264B81B2201/0257B81B2201/0235B81B2201/0242
Inventor 凯·史提芬·艾斯格
Owner ADVANCED SEMICON ENG INC