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Photosensitive resin composition, preparation method thereof, and method of producing printed circuit board

A technology of photosensitive resin and composition, which is applied in the direction of printed circuit manufacturing, printed circuit, and secondary treatment of printed circuit, etc., and can solve the problems of increasing storage cost and storage risk

Active Publication Date: 2018-07-27
ZHEN DING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the epoxy group of epoxy resin will slowly react with the carboxyl group of epoxy acrylate at room temperature, so that the solder resist green paint ink must be stored at low temperature (<5°C), which greatly increases storage costs and storage risks

Method used

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  • Photosensitive resin composition, preparation method thereof, and method of producing printed circuit board
  • Photosensitive resin composition, preparation method thereof, and method of producing printed circuit board
  • Photosensitive resin composition, preparation method thereof, and method of producing printed circuit board

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preparation example Construction

[0035] A preferred embodiment of the present invention also provides a method for preparing the above-mentioned photosensitive resin composition, which includes the following steps:

[0036] Step 1: In parts by weight, 100 parts of epoxy acrylate, 10-50 parts of acrylate monomer, 5-15 parts of photoinitiator, 1-5 parts of colorant, 10-40 parts The acrylate oligomer and 10-50 parts of the oxazoline compound are mixed with a solvent to prepare a mixture;

[0037] Step 2: Stir the mixture to dissolve the epoxy acrylate, acrylate monomer, colorant, acrylate oligomer and oxazoline compound in the solvent, so as to prepare the photosensitive resin composition.

[0038] In this embodiment, the solvent is butanone. It can be understood that the content of the solvent can be changed according to actual needs, as long as each component can be dissolved therein.

[0039] see Figure 1 to Figure 5 , a preferred embodiment of the present invention also provides a printed circuit board 1...

Embodiment 1

[0053] In parts by weight, add 100 parts of epoxy acrylate (molecular weight is 10000g / mol, acid value 100mgKOH / g), 40 parts of TMP (3PO) TA, 15 parts of aliphatic polyurethane in a 500ml reaction bottle Acrylate, 8 parts of photoinitiator, 2 parts of colorant, 30 parts of butanone, 10 parts of oxazoline compound and 0.5 part of triphenylphosphine, stir until each component is dissolved in butanone, Thus, the resin composition was prepared.

Embodiment 2

[0055] In parts by weight, 100 parts of epoxy acrylate (molecular weight is 10000g / mol, acid value 100mgKOH / g), 20 parts of TMP (3PO) TA, 30 parts of aliphatic polyurethane are successively added in a 500ml reaction bottle Acrylate, 8 parts of photoinitiator, 2 parts of colorant, 30 parts of butanone, 20 parts of oxazoline compound and 1 part of triphenylphosphine, stir until each component is dissolved in butanone, Thus, the resin composition was prepared.

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Abstract

A photosensitive resin composition includes, by weight, 100 parts of epoxy acrylate, 10-50 parts of an acrylate monomer, 10-40 parts of an acrylate oligomer, 5-15 parts of a photoinitiator, 1-5 partsof a pigment, and 10-50 parts of an oxazoline compound. The invention also provides a preparation method of the photosensitive resin composition and a method of producing a printed circuit board.

Description

technical field [0001] The invention relates to a resin composition, in particular to a photosensitive resin composition and a preparation method thereof, and a preparation method of a printed circuit board using the photosensitive resin composition. Background technique [0002] At present, the solder resist green paint ink of printed circuit boards is used to provide heat-resistant, moisture-resistant, and chemical-resistant outer protective layers on the exposed conductive line side to prevent short circuits caused by soldering lead and tin, and also It can protect the conductive circuit from being corroded by solvents and acid and alkali liquids, thereby maintaining good electrical insulation of the printed circuit board. [0003] The packaging of the solder resist green paint ink usually adopts two components, that is, the main agent and the hardener. Wherein, the main agent mainly includes epoxy acrylate with light-curing properties, and the hardener mainly includes e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004H05K3/28
CPCG03F7/004G03F7/027H05K3/287
Inventor 李昌鸿林义芳颜振锋向首睿萧嬿芹徐茂峰
Owner ZHEN DING TECH CO LTD
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