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A high-density flexible IC substrate oxidation area detection system and method

An area detection, high-density technology, used in image analysis, image enhancement, instrumentation, etc., can solve the problems of less flexible IC substrates and unreviewed flexible IC substrate oxidized area, etc., to remove noise, reduce noise removal time, and improve The effect of reliability

Active Publication Date: 2022-03-25
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are few studies on flexible IC substrates in my country, and no relevant literature on the calculation of the oxidation area of ​​flexible IC substrates has been found at the current stage.

Method used

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  • A high-density flexible IC substrate oxidation area detection system and method
  • A high-density flexible IC substrate oxidation area detection system and method
  • A high-density flexible IC substrate oxidation area detection system and method

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Embodiment Construction

[0050] The specific implementation of the present invention will be further described below with reference to the accompanying drawings and examples, but the implementation and protection of the present invention are not limited thereto.

[0051] The method for detecting the oxidized area of ​​a high-density flexible IC substrate of the present invention mainly includes three parts: (1) microscopic imaging acquisition; (2) image fusion; (3) rapid detection of the oxidized area. Among them, microscopic imaging acquisition is the first step of the flexible IC substrate oxidation area detection system, and it is also the key to the success of subsequent image processing. If the stage moves stably and then captures the image, there will be no motion blur or image shaking, and the image with this effect is better. The basic operation of microscopic imaging acquisition is to first set the relevant parameters of the camera and the current position; secondly, plan the acquisition path...

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Abstract

The invention discloses a method for detecting an oxidation area of ​​a high-density flexible IC substrate. The method is divided into five parts: color image grayscale, image denoising preprocessing, threshold segmentation, spatial filter correction, and oxidation area calculation. Firstly, the color image is grayscaled to achieve the purpose of removing redundant color space information and save time for subsequent operations; secondly, a weighted neighborhood closed curve mean template is proposed to denoise the image and the denoising time is shorter than the existing filter; Threshold segmentation again to segment the oxidized area on the copper clad board; then perform spatial filter correction, the main purpose is to remove noise, spots or isolated points, etc.; finally calculate the oxidized area in the image. The invention solves the difficult problem of rapid calculation of the area of ​​the high-resolution microscopic image in the oxidation detection process of the flexible IC substrate.

Description

technical field [0001] The invention relates to the technical field of flexible IC substrate detection, in particular to a detection method for an oxidized area of ​​a high-density flexible IC substrate. Background technique [0002] Flexible IC substrates have a wide range of applications in many industries, including automotive, military / aerospace, computer, telecommunications, medical, and consumer products. The demand for flexible IC substrates around the world is increasing year by year, and the most important applications are in mobile phones and other handheld communication and computer devices (such as PDAs, etc.). The oxidation of copper clad laminate directly affects the electrical properties of the substrate. However, there are few studies on flexible IC substrates in my country, and no relevant literature on the calculation of the oxidation area of ​​flexible IC substrates has been consulted at the current stage. Therefore, the research on high-density flexible...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/00G06T5/00G06T5/50G06T3/40G06T7/11G06T7/136
CPCG06T3/4038G06T5/50G06T7/0008G06T7/11G06T7/136G06T2207/10056G06T2207/20024G06T2207/30108G06T2207/20221G06T2207/20201G06T5/80G06T5/70
Inventor 胡跃明钟智彦罗家祥
Owner SOUTH CHINA UNIV OF TECH