Flexible electronic device module, article and manufacturing method thereof

Abstract

The foldable electronics module includes a glass cover element having a thickness of about 25-200 um, a modulus of elasticity of about 20-140 GPa, and a puncture resistance of at least 1.5 kgf. The module also includes: a stack having a thickness of about 100-600 um; and a first adhesive bonding the stack and the covering element, having a shear modulus of about 1 MPa to about 1 GPa. The stack also includes: a panel, electronics, and stacking elements secured to the panel with a stacking adhesive. In addition, the device module is characterized in that the tangential stress in tension at the major surface of the covering element after bending the module to a radius of about 20 mm to about 2 mm does not exceed about 1000 MPa.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under 35 U.S.C. §119 to U.S. Provisional Application Serial No. 62 / 290701, filed February 03, 2016, and U.S. Provisional Application Serial No. 62 / 240879, filed October 13, 2015, hereby incorporated by reference as It serves as a basis and is hereby incorporated by reference in its entirety, respectively. technical field [0003] The present disclosure generally relates to bendable electronics modules, articles, and methods of making them. More specifically, the present disclosure relates to bendable electronics modules with glass-containing covers for foldable display device applications. [0004] technical background [0005] Flexible versions of products and components that are often inherently rigid are being conceived for new applications. For example, flexible electronics can offer thin, lightweight, and flexible properties, which offer opportunities for new applications includin...

AI Technical Summary

Problems solved by technology

Meanwhile, thicker glass substrates (>150 μm) can be fabricated with better puncture resistance, but these substrates lack suitable fatigue resistance and mechanical reliability after bending

[0008] Furthermore, due to the use of these flexible glass materials as cover elements in modules that also contain electronic components (e.g., thin-film transistors (“TFT”), touch screens, etc.), additional layers (e.g., polymer electronics panels) are The interaction of agents (e.g., epoxies, optically clear adhesives (“OCAs”)) between these various components and elements can lead to greater increasingly complex stress state

These complex stress states can cause the covering element to experience increased stress levels and / or stress concentration factors

As such, these covering elements can be prone to cohesive and / or delamination failure modes within the module

In addition, these complex interactions lead to increased bending forces required by the consumer to bend and fold the cover element

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