Substrate support assembly with deposited surface features

Abstract

A method of manufacturing an electrostatic chuck includes polishing a surface of a ceramic body of the electrostatic chuck to produce a polished surface and depositing a ceramic coating onto the polished surface of the ceramic body to produce a coated ceramic body. The method further includes disposing a mask over the coated ceramic coating, the mask comprising a plurality of elliptical holes anddepositing a ceramic material through the plurality of elliptical holes of the mask to form a plurality of elliptical mesas on the coated ceramic body, wherein the plurality of elliptical mesas have rounded edges. The mask is then removed from the coated ceramic body and the plurality of elliptical mesas are polished.

Description

technical field [0001] Embodiments of the invention generally relate to substrate support assemblies, such as electrostatic chucks, having a plasma-resistant protective layer with deposited surface features. Background technique [0002] In the semiconductor industry, devices are fabricated by several fabrication processes that produce structures of ever-decreasing size. Some fabrication processes, such as plasma etch and plasma clean processes, expose substrate supports such as electrostatic chucks (ESCs) (e.g., exposing the edges of the ESC during wafer processing and during chamber cleaning). Expose the entire ESC) to a high velocity plasma stream to etch or clean the substrate. Plasmas can be highly corrosive and can corrode processing chambers and other plasma-exposed surfaces. [0003] ESCs typically have surface features formed by placing a positive mask on the surface of the ESC, and then bead blasting the exposed portions of the ESC through the positive mask. A p...

AI Technical Summary

Problems solved by technology

Trapped particles and broken spikes can cause particle contamination on the backside of the held wafer during processing

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