A kind of dry etching equipment

A dry etching and equipment technology, applied in circuits, discharge tubes, electrical components, etc., can solve problems such as reducing etching uniformity, improving electrostatic damage, and decreasing product yield.

Active Publication Date: 2020-05-05
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the substrate to be etched is suspended on the surface of the lower electrode by the buoyancy of helium and the electrostatic adsorption force, the force on the central area of ​​the substrate is different from that of the surrounding area, and each area rubs against the lower electrode during the process, resulting in varying degrees of damage to the back of the substrate. Damage, which reduces the uniformity of etching, and increases the probability of electrostatic damage, resulting in a decrease in product yield

Method used

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  • A kind of dry etching equipment
  • A kind of dry etching equipment
  • A kind of dry etching equipment

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Embodiment Construction

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0027] see figure 1 , figure 2 and image 3 , figure 1 Schematic diagram of the structure of the dry etching equipment provided by the embodiment of the present invention, figure 2 A schematic diagram of the structure of the lower electrode provided for the implementation of the present invention, image 3 A schematic plan view of the bottom electrode provided by the embodiment of the present invention.

[0028] An embodiment of the present invention provides a dry...

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Abstract

Provided is a dry etching apparatus, comprising: a reaction chamber, wherein the reaction chamber is internally provided with an upper electrode and a lower electrode; the lower electrode is provided with multiple pores, and the lower electrode comprises a first area, a second area and a third area; a voltage regulation device is connected to the lower electrode; and a gas flow regulation device is connected to the pores.

Description

technical field [0001] The invention relates to the technical field of etching, in particular to a dry etching equipment. Background technique [0002] Dry etching plays an irreplaceable role in the manufacture of display panels. In the dry etching process, plasma is generally used to etch the substrate. Existing dry etching equipment includes: a reaction chamber, an upper electrode and a lower electrode located in the reaction chamber. During specific implementation, the substrate to be etched is placed on the lower electrode, the plasma is introduced into the reaction chamber, and a voltage is applied to the upper electrode and the lower electrode so that a potential difference is formed between the two; under the action of the electric field, the plasma obtains a large High energy and high speed bombard the substrate to be etched to achieve etching. [0003] During the etching process, plasma bombardment of the substrate to be etched will transfer part of the energy to ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01J37/32
CPCH01J37/32449H01J37/32715H01J37/32724H01J2237/334H01J37/32568H01J37/32935H01J37/3299
Inventor宋德伟董磊磊
OwnerWUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD