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High Voltage Power Module

A technology of power modules and sub-modules, which is used in output power conversion devices, conversion of AC power input to DC power output, electrical equipment enclosures/cabinets/drawers, etc.

Active Publication Date: 2021-01-29
沃孚半导体公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although improvements in these aspects of power modules continue to develop, there is still significant room for improvement

Method used

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  • High Voltage Power Module
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Examples

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Embodiment Construction

[0027] The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best modes for practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It is to be understood that these concepts and applications fall within the scope of the disclosure and the appended claims.

[0028] It will be understood that, although the terms first, second etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present di...

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PUM

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Abstract

The power module includes a plurality of submodules connected via removable jumpers. The removable jumpers allow connections between one or more power semiconductor dies of each sub-module to be reconfigured such that when the removable jumpers are set, the power module has a first function and when the removable jumpers are removed When jumpered, the power module has a secondary function. Removable jumpers also allow independent testing of submodules. The power module may also include a multilayer printed circuit board (PCB) for connecting one or more contacts of the power semiconductor die. A multilayer PCB reduces stray inductance between contacts and thus improves the performance of the power module.

Description

[0001] governmental support [0002] This invention was made with Government funds under Contract No. N00014-15-C-0051 awarded by the Office of Naval Research. The US Government has certain rights in this invention. technical field [0003] The present disclosure relates to power modules, and in particular, to high voltage, high frequency power modules. Background technique [0004] A power module is an independent device that performs various functions in a power converter system. For example, a power module may include any number of switching components necessary to form a boost converter, a buck converter, a half-bridge converter, a full-bridge converter, or any portion thereof. Conventional power modules typically use power converter circuits with silicon (Si) switching components. Although effective in many applications, the use of power converter circuits with silicon switching components typically limits the switching frequency at which the power converter circuits...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M7/00H01L25/11H01L25/16H01L23/40
CPCH01L25/072H01L25/16H02M1/00H05K5/0065H05K1/0298H01L23/4093H02M7/003H02M1/088H01L2224/49111H01L23/5382H01L24/72H05K1/142H05K2201/10363H01L25/115H01L29/1608H01L29/78H05K5/0069H05K2201/10166H01L25/162
Inventor 扎卡里·科尔布兰东·帕斯莫尔
Owner 沃孚半导体公司