Multi-outlet type uniform liquid discharge device for RENA texturing equipment

Abstract

The invention discloses a multi-outlet type uniform liquid discharge device for RENA texturing equipment. The device comprises a texturing groove; a rotating shaft is arranged at the middle of the inner cavity of the texturing groove; a stirring blade is fixed onto the rotating shaft; a shifting block is fixed onto one end of the stirring blade, wherein the one end of the stirring blade is far away from the rotating shaft; a plurality of water passing pipes are disposed in the texturing groove; the water passing pipes are fixed on the inner side wall of the texturing groove; water outlets areformed at the joints of the water passing pipes and the texturing groove; one end of each water passing pipe, which is far away from the corresponding water outlet, is movably connected with a blocking plate; and the blocking plate is movably connected with the shifting block. According to the multi-outlet type uniform liquid discharge device for the RENA texturing equipment of the invention, whenliquid in the texturing groove is stirred, the water passing pipes can be opened evenly at intervals, so that the liquid can be discharged; the plurality of water passing pipes are adopted, a liquiddischarge effect is more uniform, and influence on the mixing effect of the texturing liquid in a texturing machine can be decreased; and therefore, the device is very worthy of popularization.

Description

technical field [0001] The invention relates to the technical field of silicon wafer texturing, in particular to a multi-outlet uniform liquid discharge device for RENA texturing equipment. Background technique [0002] During the cutting process of the silicon wafer, a damage layer about 10 μm thick will be formed on the surface. This layer is different from the properties of the silicon wafer substrate, which will seriously affect the performance of the solar cell. The cleaning process and the texturing process is to use the damaged layer of the silicon wafer to oxidize it with nitric acid to form a rough surface, which greatly increases the light-receiving area on the surface of the cell and reduces reflection, thereby improving the conversion efficiency of the solar cell. When making polycrystalline texturing, it is necessary to control the thinning amount of the silicon wafer, especially the thinning uniformity of the entire film of the silicon wafer. [0003] At prese...

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Problems solved by technology

[0005] Although the liquid inlet method has been improved and becomes more uniform, both the liquid inlet and the liquid discharge are issues that need to be considered by the texturing machine. When the liquid inlet method becomes uniform, the liquid outlet method uses the side wall of the texturing tank. The overflow port opened above is used for draining, so that when draining, only the texturing liquid near the overflow port will be discharged, and the uniformity of liquid discharge cannot be guaranteed, which will also affect the texture of the texturing machine. The mixing effect of the internal texturing liquid

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