Epoxy powder processing device for encapsulating electronic components

Abstract

The invention relates to an epoxy powder processing device for encapsulating electronic components. The device comprises a bottom plate, a frame body device arranged above the bottom plate, a screening device contained in the frame body device, a first electric cylinder device, a second electric cylinder device and a filtering device, wherein the first electric cylinder device, the second electriccylinder device and the filtering device are arranged on the frame body device. According to the invention, the epoxy powder processing device can be used for simultaneously carrying out the screening operation and the drying operation on epoxy powders for encapsulating electronic components. Therefore, the water on powders can be effectively removed. Particle impurities of larger particle sizesare removed, and the quality of powders is guaranteed.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to an epoxy powder processing device for encapsulating electronic components. Background technique [0002] Epoxy powder encapsulation is an indispensable material to insulate electronic components, prevent moisture and ensure stable and reliable performance. Long-term practice has proved that the factors that affect the fluidity of epoxy powder mainly lie in the thickness of the powder and whether the particle size distribution is uniform. For electronic component manufacturing enterprises, epoxy powders are generally purchased and used directly, and some of them have relatively large moisture content and different particle sizes, which will affect their use and even affect the quality of the product, so they need to be baked For dry screening, the existing drying and screening devices are often separated, and the screening and drying devices need to be purchased sep...

AI Technical Summary

Problems solved by technology

For electronic component manufacturing enterprises, epoxy powders are generally purchased and used directly, and some of them have relatively large moisture content and different particle sizes, which will affect their use and even affect the quality of the product, so they need to be baked For dry screening, the existing drying and screening devices are often separated, and the screening and drying devices need to be purchased separately. The purchase cost is high and the efficiency is low. Due to the separate process, the time is long, which affects the overall efficiency.

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