Optical module with relatively high heat dissipation performance

Abstract

The invention discloses an optical module with relatively high heat dissipation performance, and relates to the field of heat dissipation of the optical module. The optical module comprises a shell and a PCB positioned on the bottom wall of the shell; a plurality of copper layers are arranged in the PCB; an optical device is arranged on the front surface of the PCB; bright copper is arranged in the positions of the front and back surfaces, corresponding to the optical device, of the PCB separately; at least two heat dissipation through holes are formed between the bright copper on the front surface and the bright copper on the back surface of the PCB; and a heat dissipation rod is arranged in each heat dissipation through hole. By virtue of the heat dissipation rods, heat can be quickly transferred from the front surface to the back surface of the PCB, so that the heat transfer efficiency of the PCB is obviously improved, the heat dissipation performance of the optical device is greatly improved, and use safety of the optical device is ensured.

Description

Technical field [0001] The invention relates to the field of heat dissipation of optical modules, in particular to an optical module with better heat dissipation performance. Background technique [0002] The optical module includes a housing, the inner bottom of the housing is provided with a PCB (Printed Circuit Board, printed circuit board), and an optical device and other devices (such as a chip, etc.) are packaged in a pin + soldering manner on the PCB. The temperature specification of the optical device is generally 85°C case temperature. In order to ensure the normal operation of the optical device, the optical device needs to be dissipated. In a fully sealed optical module housing, the optical device is in a windless condition. Because the metal upper cover of the optical device does not touch its heat source, and the metal upper cover cannot withstand pressure, the metal upper cover of the optical device cannot touch the heat sink The method is to dissipate the optical ...

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Problems solved by technology

After testing, other devices with a temperature of 260°C to 390°C during rework, after transferring heat to the PCB area where the optical device is located, the temperature at the corresponding part of the housing and the optical device has reached above 150°C (heat transfer leads to temperature rise) , the temperature has seriously exceeded the temperature specification of the optical device (85°C shell temperature), at this time the probability of damage to the optical device is very high, once the optical device is damaged, the entire optical module cannot be used

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