Glass laser hole machining device and machining method thereof

A glass laser and laser processing technology, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems that mechanical drilling cannot cover glass, mechanical drilling is not competent, etc., and achieves a simple, low-cost, high precision effect

Inactive Publication Date: 2018-08-17
淮北辰威科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Mechanical drilling cannot cover the entire glass, and can only process holes within a certain range of product edges
If the size of the glass format exceeds 1 meter and the parts to be punched are distributed in the entire range, then mechanical drilling is simply not competent

Method used

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  • Glass laser hole machining device and machining method thereof
  • Glass laser hole machining device and machining method thereof
  • Glass laser hole machining device and machining method thereof

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] The present invention provides such as Figure 1-5 A glass laser hole processing device, including a controller, a first conveying platform 1 and a second conveying platform 3 for conveying glass 19, a Y-direction CCD visual motion platform 2 perpendicular to the conveying direction of glass 19, the first conveying platform 1 and the second conveying platform 3 are respectively arranged at the front and rear parts of the Y-direction CCD visual motion pl...

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Abstract

The invention discloses a glass laser hole machining device. The machining device comprises a controller, a first conveying platform, a second conveying platform, and a Y-direction CCD visual motion platform, wherein the first conveying platform and the second conveying platform are used for conveying glass, and the Y-direction CCD visual motion platform is perpendicular to the glass conveying direction; and a Y-direction transporting positioning device is arranged in the middle of the upper end of the Y-direction CCD visual motion platform, a protective box is arranged at the upper end of theY-direction CCD visual motion platform, the top of the inner cavity of the protective box is provided with a sensor connected with the controller and a positioning device for positioning the glass conveying position, and a laser machining device used for machining a glass hole is arranged at the top of the protective box. According to the machining device, two-dimensional large-stroke breadth machining is achieved by changing the conveying distance of a glass product and moving the one-dimensional movement of the Y-direction transporting positioning device, so that hole perforating in the full-breadth range of the large-breadth glass is achieved; and multiple simple single modules with mature technologies are creatively combined, so that a new problem is solved.

Description

technical field [0001] The invention belongs to the technical field of glass laser hole processing, and in particular relates to a glass laser hole processing device, and also relates to a glass laser hole processing device processing method. Background technique [0002] The application of glass is becoming more and more extensive. In the renewable energy photovoltaic solar industry, with the promotion of the application of solar substrates for double-glass modules, the demand for large-format photovoltaic glass has increased significantly. In the above application, it is required to process several through holes in the whole range of the large-format glass. [0003] The current mechanical drilling scheme adopts the upper and lower double drill bit processing method, and the upper and lower drill bits respectively drill a certain depth to complete the processing of the entire through hole. The drill head is divided into a cantilever structure, and the glass needs to be pla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/042B23K26/142B23K26/70B23K26/40
CPCB23K26/382B23K26/042B23K26/0838B23K26/142B23K26/402B23K26/702
Inventor 吴旋王永辉王晓全钱雷陈倩
Owner 淮北辰威科技有限公司
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