Processing method and apparatus of K-wire with chip grooves

A processing method and technology of Kirschner wires, applied in metal processing equipment, grinding/polishing equipment, other manufacturing equipment/tools, etc., can solve the problems of increased drilling temperature, difficult discharge, and bone cell damage, and achieve improved Efficiency, damage reduction, and accuracy improvement effects

Pending Publication Date: 2018-08-21
HARBIN UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the bone drilling process with Kirschner wires, powdery bone debris will be produced, which is not easy to discharge, and may easily cause the drilling temp

Method used

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  • Processing method and apparatus of K-wire with chip grooves
  • Processing method and apparatus of K-wire with chip grooves
  • Processing method and apparatus of K-wire with chip grooves

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Embodiment Construction

[0014] A Kirschner wire processing method and equipment with flutes designed in this paper mainly include: grinding system, fixture system and workpiece. The grinding system mainly includes: electric spindle Ι (7), support Ι (6) , electric spindle II (2), support II (3), grinding wheel (5) and micro saw blade (4); the fixture system mainly includes: rotary dial (11), tiltable rotary table (13), left adjustment Device (1), right adjusting device (12), left bracket (17), right bracket (14), base (15), shaking wheel (9), dial (10), rotary table (16) and motor screw Cap (18), workpiece: Kirschner wire (8) to be processed.

[0015] Concrete work process of the present invention is:

[0016] Adjust the position of the grinding wheel (5) and the micro saw blade (4) by controlling the three-axis slide rail, control the position of the Kirschner wire (20) to be processed by adjusting the rotary dial (11), shake the rocker wheel (9) to make The tiltable rotary table (13) is tilted so ...

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Abstract

Powdery bone chips may occur during K-wire bone drilling and are difficult to discharge, which easily causes a rise in the drilling temperature. At present, high heat generated by most applied K-wireshave no chip groove during drilling may damage bone cells. In order to solve the main problem, the invention designs the processing method and apparatus of a K-wire with chip grooves, mainly comprising a grinding system and a clamp system; the grinding system mainly comprises motorized spindle I(7), motorized spindle II(2), grinding wheel (5) and micro saw blade (4); the clamp system mainly comprises rotary graduated disc (11), tiltable rotary workbench (13) and rotary workbench (16). The operating principle for the processing method and apparatus of the K-wire with the chip grooves refers tothe fact: a slant is made at the tip of the K-wire by grinding, with chip grooves in various shapes processed, such that bone chips can be discharged in time and drilling temperature can be decreased.

Description

technical field [0001] The invention belongs to the technical field of medical tool processing, and in particular relates to a method and equipment for processing a Kirschner wire with chip removal grooves. Background technique [0002] During the bone drilling process with the Kirschner wire, powdery bone debris will be produced, which is difficult to discharge and may easily cause an increase in the drilling temperature. At present, most of the Kirschner wires used do not have flutes, and the high temperature generated during the drilling process will damage the bone cells. Aiming at this main problem, the present invention designs a new type of processing method and equipment for Kirschner wires with chip removal grooves, which are used to grind inclined surfaces at the tips of Kirschner wires and process chip removal grooves of various shapes to realize timely discharge. Bone chips, the purpose of reducing the drilling temperature. Contents of the invention [0003] ...

Claims

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Application Information

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IPC IPC(8): B24B19/16B24B41/06B24B41/02B23P23/04B23P15/00
CPCB23P15/00B23P23/04B24B19/16B24B41/02B24B41/06
Inventor 王义文娄德钰付鹏强闫克攀许成阳沈朋
Owner HARBIN UNIV OF SCI & TECH
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