Manufacturing method of circuit board substrate

Abstract

The invention discloses a manufacturing method of a circuit board substrate. According to the method, a substrate to be processed is provided. The method includes the following steps that: through hole drilling is performed on the substrate; two-sided coating is performed on the through hole-drilled substrate through a twin-roller type coater, a coating which coats the substrate is nano silver ink; and drying treatment is carried out, the coated substrate is arranged in a drying oven so as to be dried. According to the manufacturing method of the circuit board substrate of the present invention, the nano silver ink is applied to the surface of the substrate and into through holes by means of the twin-roller type coater, and therefore, when a circuit board is manufactured, it only needs toperform electroplating treatment on the through holes, and black hole treatment or PTH is not required, and thus, manufacturing time can be greatly decreased, and manufacturing costs are saved.

Description

technical field [0001] The invention relates to the field of circuit board substrates, in particular to a method for manufacturing a circuit board substrate. Background technique [0002] With the rapid development of electronic equipment in recent years, the requirements for circuit boards are getting higher and higher, such as mobile phones, tablet computers, monitors, navigators, etc. [0003] The conductive layer of the existing circuit board is usually made of copper. Under the trend of electronic products constantly pursuing lighter and thinner, the circuit board is also required to be thinner and thinner. Therefore, the reduction of the thickness of the circuit board directly affects The economic benefit of the enterprise; the existing circuit board adopts the electroplated copper material layer as the conductive layer, which has the following disadvantages: 1) the electroplated copper material is easily etched when the metal is etched, and it is necessary to reserve ...

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Problems solved by technology

[0003] The conductive layer of the existing circuit board is usually made of copper. Under the trend of electronic products constantly pursuing lighter and thinner, the circuit board is also required to be thinner and thinner. Therefore, the reduction of the thickness of the circuit board directly affects The economic benefit of the enterprise; the existing circuit board adopts the electroplated copper material layer as the conductive layer, which has the following disadvantages: 1) the electroplated copper material is easily etched when the metal is etched, and it is necessary to reserve a certain size of copper material for it. When etching, only wide lines can be made, and the grade of the product is low; 2) When the copper material layer is plated for the first time, the thickness of the copper material layer is more than 3 microns, making the circuit board thicker

[0004] My prior application CN107295754A and CN205793691U have announced a method for making circuit boards and a circuit board by semi-additive method respectively. In the process of making this thin circuit board, a substrate with a layer of silver material needs to be used. The middle layer is used to make a thinner circuit board, but there is a layer of silver material attached to the existing substrate, and there is no conductive layer in the hole after drilling during processing, so it is necessary to make a through-hole conductive layer. The process of making the through-hole conductive layer is relatively complicated. The PTH or black hole process is usually used to make the conductive layer, which is easy to damage the silver material layer on the substrate during the manufacturing process. Therefore, how to avoid this process has always been a difficult problem in this field.

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