An image sensor and its manufacturing method

A technology of an image sensor and a manufacturing method, which is applied to semiconductor devices, electric solid-state devices, radiation control devices, etc., can solve the problems of increasing the multiple processing of the substrate, high cost, etc.

Active Publication Date: 2020-10-20
隋浩智
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Existing image sensor packages often require the migration of lead-out terminals by forming a redistribution layer on the back of the substrate to achieve electrical interconnection with existing PCBs and other circuit boards. This migration method increases the substrate’s Multiple processing and high cost

Method used

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  • An image sensor and its manufacturing method
  • An image sensor and its manufacturing method
  • An image sensor and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0059] see Figure 1-9 , a method for manufacturing an image sensor, comprising the steps of:

[0060] (1) A substrate 1 is provided, and the substrate 1 has an opposite first surface and a second surface, and a plurality of light receiving regions 11 are provided on the first surface and a plurality of light receiving regions 11 are provided on the first surface. Multiple electrodes 12 on both sides;

[0061] (2) forming a plurality of first through holes 13 in the substrate 1, the plurality of first through holes 13 are separated from the plurality of electrodes 12 by a certain distance;

[0062] (3) Alignment marks 5 are formed near the plurality of light-receiving regions 11, and partition walls 2 formed between the plurality of light-receiving regions 11 are formed by injection molding, and the partition walls 2 cover the plurality of electrodes 12 , but does not cover the plurality of light receiving regions 11 and the alignment mark 5;

[0063] (4) A plurality of seco...

no. 2 example

[0076] see Figure 10-11 , the present invention also provides another method for manufacturing an image sensor, which is similar to the first embodiment, except that a conductive pattern connecting two light-receiving regions is added on the transparent substrate, including the following steps:

[0077] (1) A substrate is provided, the substrate has an opposite first surface and a second surface, a plurality of light receiving regions are provided on the first surface, and a plurality of light receiving regions are provided on both sides of the plurality of light receiving regions. electrodes;

[0078] (2) forming a plurality of first through holes in the substrate, the plurality of first through holes being separated from the plurality of electrodes by a certain distance;

[0079] (3) forming alignment marks near the plurality of light-receiving regions, and forming partition walls between the plurality of light-receiving regions by injection molding, the partition walls co...

no. 3 example

[0092] see Figure 12 , the present invention provides a kind of manufacturing method of image sensor again, comprises the following steps:

[0093] (1) A substrate is provided, the substrate has an opposite first surface and a second surface, a plurality of light receiving regions are provided on the first surface, and a plurality of light receiving regions are provided on both sides of the plurality of light receiving regions. electrodes;

[0094] (2) forming alignment marks near the plurality of light-receiving regions, and forming partition walls between the plurality of light-receiving regions by injection molding, the partition walls covering the plurality of electrodes but not covering the a plurality of light receiving areas and the alignment mark;

[0095] (3) forming a plurality of through holes in the partition wall, the bottom surfaces of the plurality of through holes are respectively in contact with the plurality of electrodes;

[0096] (4) forming a connector o...

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PUM

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Abstract

The invention provides an image sensor and a manufacturing method thereof. A redistribution effect can be realized without forming a redistribution layer structure on a substrate, so that the method is flexible and easy to operate; and series-parallel connection among a plurality of sensor chips can be realized, so that electric connection after package is no longer needed.

Description

technical field [0001] The invention relates to the sensor field of sensitive components, in particular to an image sensor and a manufacturing method thereof. Background technique [0002] The simplest electronic device in the photosensitive sensor is the photoresistor, which can sense the light and dark changes of the light, output a weak electrical signal, and control the automatic switch of the LED lamp through simple electronic circuit amplification. Therefore, it is widely used in automatic control and household appliances. For remote lighting fixtures, such as: automatic brightness adjustment in TVs, automatic exposure in cameras; Stop device and anti-theft alarm device Medium [0003] Photosensitive sensor is one of the most common sensors. It has a wide variety, mainly including: photocell, photomultiplier tube, photoresistor, phototransistor, solar cell, light sensor, ultraviolet sensor, fiber optic photoelectric sensor, color sensor, CCD and CMOS image sensor, et...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
CPCH01L27/14636H01L27/14687
Inventor 隋浩智
Owner 隋浩智
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