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Method for preparing electronic equipment shell, electronic equipment shell and electronic equipment

A technology for electronic equipment and shells, which is applied in the field of electronic products and can solve problems such as poor antenna adhesion, easy wear and tear, and antenna function failure.

Active Publication Date: 2018-08-28
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the antenna of electronic equipment is formed on the electronic equipment housing by printing during the preparation of the electronic equipment housing. The antenna formed in this way has poor adhesion and is easy to wear and fall off during use, resulting in the failure of the antenna function.
[0003] Thereby, the existing method for preparing electronic equipment casing still needs to be improved

Method used

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  • Method for preparing electronic equipment shell, electronic equipment shell and electronic equipment
  • Method for preparing electronic equipment shell, electronic equipment shell and electronic equipment
  • Method for preparing electronic equipment shell, electronic equipment shell and electronic equipment

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Embodiment Construction

[0025] Embodiments of the present invention are described in detail below. The embodiments described below are exemplary only for explaining the present invention and should not be construed as limiting the present invention. If no specific technique or condition is indicated in the examples, it shall be carried out according to the technique or condition described in the literature in this field or according to the product specification. The reagents or instruments used were not indicated by the manufacturer, and they were all commercially available conventional products.

[0026] In one aspect of the present invention, the present invention provides a method of making an electronic device housing 200 . According to an embodiment of the present invention, refer to figure 1 and Figures 2a to 2b ( Figure 2a and Figure 2b The left figure in the middle is a schematic diagram of the planar structure, and the right figure is a schematic cross-sectional structure diagram alo...

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Abstract

The invention provides a method for preparing an electronic equipment shell, the electronic equipment shell and electronic equipment. The method for preparing the electronic equipment shell comprisesthe steps that a metal layer is formed on the partial surface of a base material to obtain a prefabricated part; the prefabricated part is subjected to sintering. The method is simple and convenient to operate and easy to achieve, industrial production is easy, the metal layer on the prepared electronic equipment shell and the base material melt together, the adhesion is high, wear or shedding isnot prone to happen, the performance is excellent, the reliability is good, and meanwhile, the superhigh corrosion resistance property and the permanent wear resistance property are achieved.

Description

technical field [0001] The invention relates to the technical field of electronic products, and in particular, relates to a method for preparing an electronic device casing, an electronic device casing and an electronic device. Background technique [0002] At present, the antenna of the electronic equipment is formed on the housing of the electronic equipment by printing during the preparation of the housing of the electronic equipment. The adhesion of the antenna formed in this way is poor, and it is easy to wear and fall off during use, resulting in the failure of the antenna function. [0003] Therefore, the existing methods for preparing electronic equipment housings still need to be improved. Contents of the invention [0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. For this reason, an object of the present invention is to propose a kind of simple to operate, convenient, easy to realize, easy...

Claims

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Application Information

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IPC IPC(8): C23C14/18C23C14/24C23C14/32C23C14/34C23C14/58
CPCC23C14/18C23C14/185C23C14/24C23C14/32C23C14/34C23C14/5806
Inventor 蒋正南
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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