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A chip bonding device

A chip bonding and chip technology, used in transportation and packaging, electrical components, conveyor objects, etc., can solve the problems of bonding accuracy and yield that cannot meet the needs of mass production, and achieve the effect of expanding the scope of application

Active Publication Date: 2020-01-24
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a chip bonding device, which is used to solve the problem that the bonding accuracy and yield of existing equipment cannot meet the mass production requirements during chip bonding

Method used

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  • A chip bonding device
  • A chip bonding device
  • A chip bonding device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] See figure 2 with image 3 , A chip bonding device, comprising a chip sucking and separating unit 100, a bonding hand module 200, a substrate supply unit 300, and a chip alignment system. The chip alignment system is provided in the chip sucking and separating unit 100 and the chip Between the substrate supply units 300, the bonding hand module 200 is bridged above the chip picking and separating unit 100, the chip alignment system, and the substrate supply unit 300. See Figure 4 with Figure 5 , The bonding hand module 200 includes a first moving table 220, a plurality of bonding hands 230 arranged on the first moving table 220, and a first driving device 250 for driving the first moving table 220 to move. . In this embodiment, the first motion platform 220 is a rotary motion platform, and the bonding hand 230 is circumferentially arranged on the first motion platform 220. The rotation of the first moving table 220 drives the multiple bonding hands 230 to index at the...

Embodiment 2

[0062] See Figure 9 to Figure 14 The difference between the second embodiment and the first embodiment is that, in this embodiment, the second motion stage 420 adopts a linear reciprocating motion stage. At this time, the die-up chip measuring suction cup 430 moves from the bonding hand 230 The position when the chip 140 is sucked up coincides with the position when the bonding hand 230 sucks the chip 140 from the die-up chip measuring suction cup 430, which is specifically as follows Picture 10 It is represented by POS.A, Picture 10 POS.B is used in the middle to indicate the position of the second visual alignment unit 440. Please continue to see Figure 11-14 There can be two die-up chip measuring suckers 430, and four bonding hands 230 can be set. The present invention does not limit the number of die-up chip measuring suckers 430 and bonding hands 230. .

[0063] The cooperation process between the bonding hand module and the die-up chip alignment module in this embodime...

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PUM

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Abstract

The invention discloses a chip bonding device, which comprises a chip absorbing and separating unit, a bonding hand module, a substrate supply unit and a chip alignment system, wherein the chip alignment system is arranged between the chip absorbing and separating unit and the substrate supply unit, the bonding hand module comprises a first moving platform, a plurality of bonding hands arranged onthe first moving platform and a first driving device used for driving the first moving platform to move, and the bonding hands move to and from among the chip absorbing and separating unit, the chipalignment system and the substrate supply unit through the first moving platform so as to realize that when one bonding hand transfers to a chip pickup station and absorbs a chip from the chip absorbing and separating unit, at least one bonding hand in the other bonding hands performs chip position recognition at a chip alignment station through the chip alignment system and / or bonds the chip on asubstrate of the substrate supply unit at a chip bonding station, so that the production efficiency is improved.

Description

Technical field [0001] The invention relates to a chip bonding device. Background technique [0002] The flip chip bonding process is a form of interconnection that connects the chip to the carrier. The bonding technology can achieve maximum chip stacking and integration in a limited area without reducing the line width, while reducing the system-on-chip (SoC) package volume and line conduction length, thereby improving the wafer transmission efficiency. Chip-to-wafer (C2W) technology has a higher yield and lower product cost than wafer-to-wafer (W2W) technology. How the C2W technology has a higher yield while ensuring high bonding accuracy is the goal of the industry's efforts. [0003] Due to the trend of light, thin and miniaturization of electronic products, the application of chip bonding technology is increasing. The combination of chip bonding process and wafer-level packaging process is conducive to reducing package size and improving packaging products. Performance, in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67144H01L21/677
Inventor 朱岳彬郭耸陈飞彪夏海
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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