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Split chip carrier board handling and bonding device

A bonding device, split-type technology, applied in the field of split-type chip carrier board handling bonding device, can solve the problems of long bonding time, low yield, difficulty in meeting mass production requirements, etc., to improve yield and save exposure the effect of time

Active Publication Date: 2020-11-20
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the entire process is completed in series, the yield is very low due to the long bonding time and it is difficult to meet the needs of mass production

Method used

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  • Split chip carrier board handling and bonding device
  • Split chip carrier board handling and bonding device
  • Split chip carrier board handling and bonding device

Examples

Experimental program
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Embodiment Construction

[0028] The following will combine Figure 1 to Figure 7 The split-type chip carrier handling and bonding device provided by the present invention is described in detail, which is an optional embodiment of the present invention, and it can be considered that those skilled in the art can make it Make revisions and polish.

[0029] Please refer to figure 1 , which shows a schematic diagram of the flip-chip bonding process flow. The pre-bonded chip 2 is placed on the carrier 1 with the device surface 3 facing upward, and the bonded chip 2 is bonded to the substrate 4 by grabbing and flipping the robot. L The pitch for bonding chips can be adjusted according to different process requirements.

[0030] Please refer to figure 2 , where the plurality of chips 2 on the carrier 1 are batch-bonded to the substrate 4 in a manner carried by the carrier 5, and the plurality of chips 2 are accurately placed and adsorbed on the carrier 5, and the chips 2 are The space between the chip 2 ...

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PUM

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Abstract

The invention provides a split chip support plate carrying and bonding device. The split chip support plate carrying and bonding device is characterized by comprising a chip pickup and separation module, a batch chip alignment and fine adjustment module and a chip mass bonding module, wherein the chip pickup and separation module is used for separating chips from carriers and transmitting the chips to connection support plates, the connection support plate is used for transmitting the chips to the batch chip alignment and fine adjustment module in batches, the batch chip alignment and fine adjustment module is used for adjusting positions of the chips which are transmitted in each batch on the connection support plates and transferring the connection support plates to transition positions, and the chip mass bonding module is used for taking the connection support plates out of the transition positions and moving and adjusting the connection support plates to reach bonding positions so that the chips on the connection support plates are bonded to a base to obtain a substrate.

Description

technical field [0001] The invention relates to the bonding technology of chips and wafers, in particular to a split-type chip carrier plate handling and bonding device. Background technique [0002] The flip chip bonding process is a form of interconnection formed by connecting a chip to a carrier. Due to the development trend of electronic products towards lightness, thinness and miniaturization, the application of chip bonding technology is increasing. Combining chip bonding technology with wafer-level packaging technology can produce smaller package size and higher performance. In addition, if the chip bonding process is combined with the TSV (Through Silicon Via) process, a chip structure with more competitive cost and performance can be produced. [0003] In the known chip flip-chip bonding equipment, a single chip is picked up from the source by a suction head matching the size of the chip, and then the chip is directly bonded on the substrate to form an interconnect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67144
Inventor 郭耸朱岳彬陈飞彪夏海余斌
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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