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Printed circuit board and mobile terminal

A printed circuit board and board body technology, which is applied in the direction of printed circuit, printed circuit parts, printed circuit grounding device, etc., can solve the problems of high temperature, limited thickness and space of mobile terminals, etc.

Inactive Publication Date: 2018-09-07
QINGDAO HISENSE MOBILE COMM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] An embodiment of the present invention provides a printed circuit board and a mobile terminal to solve the problem of local high temperature in the prior art due to the limited thickness and space of the mobile terminal

Method used

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  • Printed circuit board and mobile terminal
  • Printed circuit board and mobile terminal
  • Printed circuit board and mobile terminal

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Embodiment Construction

[0020] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0021] In the prior art, a heat conduction path can be formed between the control chip 40, the wiring layer 10, and the target module 51. In a scenario where the thickness and space of the mobile terminal are limited, the target module 51 is easily affected by the control chip 40. high temperature. At present, it is a...

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Abstract

The embodiment of the invention provides a printed circuit board and a mobile terminal. The printed circuit board comprises a board body, wherein a control chip and a target module are arranged on a routing layer positioned on the surface layer of the board body; a copper-clad cutting area is arranged on the target routing layer fixedly provided with the target module; the copper-clad cutting areais positioned around the target module; ground reflux openings are further formed in the periphery of the target module, and are used for electrically connecting a copper-clad area encircled by the copper-clad cutting area and a main copper-clad area on the target routing layer. Clad copper on the target wiring layer is cut along the periphery of the target module to form an unclosed copper-cladcutting area provided with the ground reflux openings, so that under the condition that normal routing of the target module is not influenced, a heat conduction passage between the control chip and the target module is cut, and most heat of the control chip conducted to the target module is blocked. The printed circuit board is simple in structure and low in cost, and the technical problem that the local temperature of the target module is excessively high can be solved effectively on the basis of without occupying extra heat dissipation space.

Description

Technical field [0001] The present disclosure relates to the technical field of mobile terminals, and in particular to a printed circuit board and a mobile terminal. Background technique [0002] PCB board (English full name: Printed Circuit Board, printed circuit board) is a provider of electrical connections for electronic components. Each electronic component can be electrically connected through metal wiring to achieve signal transmission and communication. According to the number of wiring layers, PCB boards can be divided into single-layer boards, double-layer boards, and multi-layer boards. Take double-layer PCB board as an example, please refer to figure 1 , Shows a schematic diagram of a typical double-layer PCB board structure. by figure 1 It can be seen that the double-layer PCB includes two wiring layers 10, and the two wiring layers 10 are glued together by an isolation layer 20. The wiring layer 10 is usually a copper layer to achieve the inter-chip interconnection...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H01L23/367
CPCH05K1/0203H05K1/0215H01L23/367H01L23/552H05K1/0206H05K1/0224H05K1/0243
Inventor 赵清毅
Owner QINGDAO HISENSE MOBILE COMM TECH CO LTD