Printed circuit board and mobile terminal
A printed circuit board and board body technology, which is applied in the direction of printed circuit, printed circuit parts, printed circuit grounding device, etc., can solve the problems of high temperature, limited thickness and space of mobile terminals, etc.
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[0020] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0021] In the prior art, a heat conduction path can be formed between the control chip 40, the wiring layer 10, and the target module 51. In a scenario where the thickness and space of the mobile terminal are limited, the target module 51 is easily affected by the control chip 40. high temperature. At present, it is a...
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