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Manufacturing method of high-transmittance type LED lamp

A technology of LED lamps and manufacturing methods, which is applied to semiconductor devices of light-emitting elements, lighting devices, light sources, etc., to achieve the effects of improved light transmission, reasonable structure, and precise positioning

Inactive Publication Date: 2018-09-14
海宁市强盛灯泡有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the processing devices used in our country are large-scale stamping machines, which cannot be well applied to the production of LED lamps.

Method used

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  • Manufacturing method of high-transmittance type LED lamp
  • Manufacturing method of high-transmittance type LED lamp
  • Manufacturing method of high-transmittance type LED lamp

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Embodiment Construction

[0038] The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.

[0039] Such as figure 1As shown, a method for manufacturing a high-transparency LED lamp, the high-transparency LED lamp includes a base 15 and a lamp body 14 connected to the base 15, the lamp body 14 is provided with an LED lamp sheet 16, and the LED lamp sheet 16 includes a PCB board and a number of lamp beads arranged on the PCB board, the lamp body has a high-permeability layer, and the base 15 is also provided with a control circuit assembly 17;

[0040] The manufacturing method includes the following steps: a. Stamping and forming of the base 15: stamping raw materials into the base 15 through an LED lamp processing device; b. Preparation of a high-transparency layer: selecting a lamp body 14 that matches the base 1...

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Abstract

The invention provides a manufacturing method of a high-transmittance type LED lamp, and belongs to the technical field of LED. The problem of low production efficiency in the prior art is solved. According to the manufacturing method of the high-transmittance type LED lamp, the high-transmittance type LED lamp comprises a base and a lamp body connected with the base, an LED lamp plate is arrangedin the lamp body, and comprises a PCB and a plurality of bulbs arranged on the PCB, the lamp body is provided with a high-transmittance glass layer, and the base is further provided with a control circuit assembly. The manufacturing method comprises the following steps: a, punch forming of the punching a raw material into the base by an LED lamp processing device; b preparation of the high-transmittance glass layer: selecting the lamp body which is matched with the base from the market, and coating the lamp body with a high-transmittance glass coating through a coating machine; c, manufacturing of the LED lamp plate: assembling the LED bulbs to the PCB through a gluing machine and an air gun; d, selecting the control circuit assembly; and e, assembling and forming. The manufacturingmethod of the high-transmittance type LED lamp has the advantage that the production efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of LED lamps, and relates to a method for manufacturing a high-transmittance LED lamp. Background technique [0002] LED lamps have high luminous efficiency, are high-quality cold light sources, and are also a new type of very energy-saving and environmentally friendly lighting fixtures. They are increasingly popular and replace traditional lamps. At present, water-based resins such as acrylic emulsion and poly etc. as a binder, adding inorganic substances as a light-diffusing material, and other additives. The environmental protection of this kind of coating is relatively better, but the inorganic particles still have the problem of agglomeration and light blocking, and the light transmittance of the coating is still poor. [0003] The LED lamp is an electroluminescent semiconductor material chip, which is cured on the bracket with silver glue or white glue, and then connected to the chip and the circuit b...

Claims

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Application Information

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IPC IPC(8): F21K9/232F21K9/238F21K9/69F21K9/90F21Y115/10
CPCF21K9/232F21K9/238F21K9/69F21K9/90F21Y2115/10
Inventor 顾孙祥
Owner 海宁市强盛灯泡有限公司
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