A Method of Measuring Interface Thermal Resistance Between Two Solids Using Hot Wire Method

A technology of interface thermal resistance and hot wire method, which is applied in the field of measuring the interface thermal resistance between two solids by hot wire method, can solve the problems of high equipment purchase cost and large initial investment, and achieve the effect of low cost, accurate precision and saving money

Active Publication Date: 2021-01-29
CHINA UNIV OF MINING & TECH
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Problems solved by technology

For the existing transient measurement, although the measurement speed is fast, the measurement condition i

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  • A Method of Measuring Interface Thermal Resistance Between Two Solids Using Hot Wire Method
  • A Method of Measuring Interface Thermal Resistance Between Two Solids Using Hot Wire Method
  • A Method of Measuring Interface Thermal Resistance Between Two Solids Using Hot Wire Method

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Embodiment Construction

[0039] The present invention will be further described below.

[0040] Such as Figure 1-Figure 3 Shown, concrete steps of the present invention are as follows: a kind of method for measuring interfacial thermal resistance between two solids with hot wire method, comprises the following steps:

[0041] Step 1: First prepare a measurement sample, the thickness of the measurement sample is marked as t, the length is marked as a, and the width is marked as b. The measurement sample includes material I1 and material II2, and the contact surface of material I1 and material II2 is Interface 3, the thicknesses of material I1 and material II2 can be set according to the needs of the experiment. In this embodiment, the thicknesses of material I1 and material II2 each account for 1 / 2 of the thickness of the measurement sample. Two measurement samples are prepared, and the measurement sample Materials Ⅱ2 are stacked facing each other;

[0042] Step 2: Define the two measurement samples...

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Abstract

The invention discloses a method for measuring the thermal resistance of an interface between two solids by using a hot wire method. The material properties are assigned to the calculation model, and the interface in the model is set to have thermal resistance; (4) Given the range of thermal resistance values, traverse all the thermal resistance values ​​R to solve the calculation model; (5) Draw the interface thermal resistance of the three-dimensional heat transfer model R curve family; (6) use the hot wire method to measure the actual material, and draw the actual measured thermal resistance curve; (7) compare the actual thermal resistance curve with the standard thermal resistance curve, and the range of the actual thermal resistance can be obtained . The interface thermal resistance can be measured more accurately, the cost of measuring the interface thermal resistance is reduced, the measurement time is reduced, and the rate of measuring the interface thermal resistance is improved.

Description

technical field [0001] The invention relates to a method for measuring thermal resistance, in particular to a method for measuring interface thermal resistance between two solids by using a hot wire method. Background technique [0002] The thermal resistance generated at the contact interface between two objects is called contact thermal resistance. The research on contact thermal resistance originated from the "Kapitza" thermal resistance between liquid helium and copper surface, and then many scholars conducted extensive and in-depth research on the interface thermal resistance (TCR) between two solid surfaces. Contact thermal resistance is an important parameter in the design of electronic devices, such as IC design of nanostructures in microelectronic packaging, surface coating materials, thermoelectric devices, superconducting thin films, semiconductor thin films, LED packaging design, optical data access devices, ultra-short Pulsed lasers, low-temperature superconduc...

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Application Information

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IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 黄丛亮钟金鑫吴东旭
Owner CHINA UNIV OF MINING & TECH
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