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Photosensitive adhesive, as well as preparation method and application thereof

A technology of adhesive and photosensitive adhesive, which is applied in the direction of optomechanical equipment, photosensitive materials used in optomechanical equipment, optics, etc., can solve the problem of short service life, photosensitive adhesive does not have ion migration resistance function, and poor insulation ability and other problems, to achieve the effect of prolonging the service life, avoiding metallization, and enhancing the insulation capacity

Active Publication Date: 2018-09-14
SUZHOU CHENGBANG DALI MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The first object of the present invention is to provide a photosensitive adhesive to alleviate the technical problems that the photosensitive adhesive in the prior art does not have the function of ion migration resistance, poor insulation ability, and short service life

Method used

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Examples

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preparation example Construction

[0075] The present invention also provides the preparation method of above-mentioned photosensitive adhesive, comprising:

[0076] The raw materials in the formulation amount were mixed evenly to prepare the photosensitive adhesive.

[0077] The method is easy to operate and strong in practicability, and the prepared photosensitive adhesive has the function of ion migration resistance, strong insulation ability and long service life, and is suitable for popularization and application.

[0078] Preferably, the liquid resin is added first, and then the corresponding solid substance is added and stirred evenly, so that the solid substance is fully dissolved.

[0079] In addition, the present invention also provides the application of the above photosensitive adhesive or the photosensitive adhesive prepared by using the above photosensitive adhesive preparation method in preparing a photosensitive cover film.

[0080] The photosensitive cover film prepared by using the photosensi...

Embodiment 1

[0083] This embodiment provides a photosensitive adhesive, comprising:

[0084] 40 parts of photosensitive aminoacrylic resin, 20 parts of glycidyl acrylate, 15 parts of high temperature resistant epoxy resin, 5 parts of polyamide, 1 part of benzophenone, 5 parts of benzoin dimethyl ether, 1 part of silicon oxide, 5 parts of carbon black part and 0.1 part of potassium dihydrogen phosphate.

Embodiment 2

[0086] This embodiment provides a photosensitive adhesive, comprising:

[0087] 80 parts of photosensitive aminoacrylic resin, 5 parts of glycidyl acrylate, 30 parts of high temperature resistant epoxy resin, 1 part of polyamide, 5 parts of benzophenone, 1 part of benzoin dimethyl ether, 5 parts of silicon oxide, 1 part of carbon black 1 part and 1 part potassium dihydrogen phosphate.

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PUM

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Abstract

The invention provides a photosensitive adhesive, as well as a preparation method and application thereof, and relates to the technical field of chemical materials. The photosensitive adhesive is prepared from an acrylic resin, a reactive diluent, a high-temperature-resistant epoxy resin, a curing agent, a photoinitiator, a photosensitizer, a filler, a pigment and phosphate. The photosensitive adhesive has ionic migration resistance, so that metallization of a photosensitive cover film is avoided, high insulation capability is achieved, the service life can be greatly prolonged and the cost isreduced. The preparation method for the photosensitive adhesive is convenient to operate, high in practicability and suitable for popularization and application. The photosensitive adhesive is applied to preparation of the photosensitive cover film. The photosensitive cover film prepared from the photosensitive adhesive has the ionic migration resistance, high insulation capability and long service life, and the cost can be effectively reduced.

Description

technical field [0001] The invention relates to the technical field of chemical materials, in particular to a photosensitive adhesive and its preparation method and application. Background technique [0002] Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. [0003] The photosensitive cover film is a protective insulating film for copper foil in the flexible circuit board industry. However, metal ions migrate to the insulating film section. There are a large number of copper ions on the photosensitive cover film, which will cause metal ionization when the photosensitive cover film is used for a long time phenomenon, thus losing the insulation effect after a period of use, resulting in adverse effects such as short circuit. [0004] Therefore, it is particularly importan...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027G03F7/033G03F7/032
CPCG03F7/004G03F7/027G03F7/032G03F7/033
Inventor 闫勇高小君
Owner SUZHOU CHENGBANG DALI MATERIAL TECH
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