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A kind of preparation method of heat dissipation substrate

A technology for heat dissipation substrates and substrates, which is applied in the direction of circuit heating devices, printed circuit manufacturing, printed circuit components, etc., can solve the problems of heat dissipation substrate warpage and uneven stress, and achieve the effect of avoiding warpage

Active Publication Date: 2021-04-13
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a method for preparing a heat dissipation substrate to solve the problem that the metal plate with a target pattern formed after etching will warp the prepared heat dissipation substrate due to uneven stress in the prior art. song problem

Method used

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  • A kind of preparation method of heat dissipation substrate
  • A kind of preparation method of heat dissipation substrate
  • A kind of preparation method of heat dissipation substrate

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Experimental program
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preparation example Construction

[0022] figure 1 The flow chart of the preparation method of the heat dissipation substrate provided by the embodiment of the present invention, such as figure 1 As shown, the method may include:

[0023] Step 101, obtaining a material tape with a heat dissipation element.

[0024] The heat dissipation element is conductive or non-conductive.

[0025] The radiating element is a pre-selected heat radiating element with a good surface shape, and it can be an element capable of heat dissipation in the prior art, such as a heat-conducting metal block.

[0026] The material strip may have a heat dissipation element, and connectors are connected to opposite sides of the heat dissipation element; or, the material strip may have at least two heat dissipation elements, at least two heat dissipation elements are arranged according to a predetermined rule, and every adjacent two Connecting pieces are connected between the cooling elements.

[0027] Wherein, the connection between the ...

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Abstract

The invention discloses a method for preparing a heat dissipation substrate. The method comprises: obtaining a strip with a heat dissipation element; if the heat dissipation element has conductivity, forming an insulating layer on the outer surface of the strip; The heat dissipation element of the material tape is placed on the predetermined position of the substrate; the surface of the substrate on which the heat dissipation element is placed is covered with a conductive layer, and the heat dissipation element is located between the conductive layer and the substrate ; Laminating the substrate, the heat dissipation element and the conductive layer. Since the heat dissipation element is a heat dissipation element with a better shape selected in advance when obtaining the tape, its thickness is not limited, which can avoid warping of the heat dissipation substrate formed by the lamination process due to the trapezoidal shape of the heat dissipation element, ensuring This ensures the smooth progress of the subsequent process and obtains a heat dissipation substrate that meets the requirements.

Description

technical field [0001] The invention relates to the technical field of production and manufacturing, in particular to a method for preparing a heat dissipation substrate. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. The electronic components supported by the heat dissipation substrate will generate heat during operation, especially for ICs with dense circuit sets and dense hole designs and components with high-power light-emitting diodes, the heat dissipation requirements for the heat dissipation substrate are getting higher and higher. In order to improve the heat dissipation effect, embedding a high thermal conductivity metal block directly in the printed circuit board is one of the effective ways to solve the heat dissipation problem. [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0204H05K3/0061
Inventor 韩建国孙学彪吉圣平吴爽
Owner VIVO MOBILE COMM CO LTD