Tube supply device for material tube in integrated circuit packaging equipment

A technology for integrated circuits and packaging equipment, which is applied in the field of tube supply devices for material tubes in integrated circuit packaging equipment, and can solve problems such as high cost, unfavorable management, and many employees.

Inactive Publication Date: 2018-09-21
莆田市长吉贸易有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The packaged material tube can be simply understood as the material tube of the IC chip. The material tube of the IC chip generally refers to a transparent plastic packaging tube. The tube needs to be customized according to the shape of the IC, which is a non-standard product. The current packaging equipment only It is possible to package a single IC shape, but to package different ICs in batches needs to customize different packaging equipment, which is costly and requires many employees, which is not conducive to management

Method used

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  • Tube supply device for material tube in integrated circuit packaging equipment
  • Tube supply device for material tube in integrated circuit packaging equipment
  • Tube supply device for material tube in integrated circuit packaging equipment

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Embodiment

[0024] see Figure 1-Figure 5 , the present invention provides a pipe supply device for a material pipe in integrated circuit packaging equipment, its structure includes a controller 1, a wireless transmitter 2, a conveyor 3, an integrated circuit supply pipe packaging device 4, a dust cover 5, and a reclaiming hatch 6 , casters 7, four casters 7 are evenly spaced at the bottom of the integrated circuit supply tube packaging device 4, and the integrated circuit tube supply packaging device 4 is threaded. One side of the device 4 is provided with a controller 1 and the two adopt interference fit, the top of the controller 1 is provided with a wireless transmitter 2 and the two are connected by threads, and the front and rear ends of the integrated circuit supply tube packaging device 4 are A dust cover 5 and a conveyor 3 are respectively provided, and the dust cover 5 and the integrated circuit supply tube packaging device 4 adopt clearance fit, and the described conveyor 3 and...

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PUM

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Abstract

The invention discloses a tube supply device for a material tube in integrated circuit packaging equipment. The tube supply device structurally comprises a controller, a wireless transmitter, a conveyor, an integrated circuit tube supply packaging device, a dustproof cover, a material taking cabin door and castors, wherein the conveyor is matched with the integrated circuit tube supply packaging device; the material taking cabin door is arranged below the dustproof cover and hinged to the outer wall of the integrated circuit tube supply packaging device. The integrated circuit tube supply packaging device disclosed by the invention can drive an internal driving mechanism to transport the material tube by using the controller to input an instruction; the tube supply device has a simple internal structure and is low in construction cost; when the material tube is transmitted to a vacuum packaging mechanism, the material tube automatically wraps an IC to realize package, and different ICscan be packaged by changing different packaging backforms.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging equipment, in particular to a tube supply device for material tubes in integrated circuit packaging equipment. Background technique [0002] An integrated circuit is a microelectronic device or component that uses a certain process to interconnect components such as transistors, resistors, capacitors, and inductors required in a circuit, and interconnects them together to form a small or several small semiconductor chips or chips. Dielectric substrate, and then packaged in a package, to become a microstructure with the required circuit functions; all the components have been integrated in the structure, making electronic components towards miniaturization, low power consumption, intelligence and high reliability. A big step forward in terms of performance, it is represented by the letter "IC" in the circuit. The inventors of the integrated circuit are Jack Kilby and Robert Noy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/677H01L21/67121
Inventor 余瑞钊
Owner 莆田市长吉贸易有限公司
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