Ultralow-temperature condensation enrichment system
An ultra-low temperature and enrichment technology, applied in the direction of refrigerators, refrigeration components, refrigeration and liquefaction, etc., can solve the problems of large cooling loss and large volume, and achieve the effect of reducing volume, reducing volume and reducing heat capacity
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[0068] Example 1
[0069] Such as Figure 1-6 As shown, an ultra-low temperature condensation enrichment system of the present invention includes:
[0070] The dewatering pipeline system includes a dewatering pipe 6 and a dewatering pipe heating device, wherein the dewatering pipe 6 includes a first pipe layer 300, a second pipe layer 301 arranged outside the first pipe layer 300, and The second piping layer 301 is used to transfer cold energy to the first piping layer 300, to cool the first piping layer 300, and to make the sample gas passing through the first piping layer 300 Water vapor is condensed on the inner wall of the first pipeline layer 300 to achieve dewatering of the sampled gas. The water removal pipe heating device is used to heat the first pipeline layer 300 to condense on the first pipeline layer 300 The water vapor in 300 evaporates to realize the drying of the water removal pipe 6;
[0071] The enrichment desorption pipeline system includes the enrichment desorpt...
Example Embodiment
[0091] Example 2
[0092] Since the refrigeration temperature of the enrichment desorption tube 7 and the dewatering pipe 6 are different, the enrichment desorption tube 7 generally needs to be around -150°C, and the temperature of the dewatering pipe 6 needs to be around -50°C. Therefore, two different types need to be obtained from the refrigeration system 1 at the same time. The cold source of temperature. In order to further reduce the space occupied by the ultra-low temperature condensation enrichment system and reduce energy consumption, the cold source providing device of the present invention adopts a special structure. The structure of the cold source providing device is specifically introduced below:
[0093] Such as Figure 7 with 8 As shown, the cold source providing device of the present invention includes a refrigeration system 1 and a cold source distribution system 10;
[0094] The refrigeration cold head 2 of the refrigeration system 1 is adapted to be connected to ...
Example Embodiment
[0099] Example 3
[0100] The difference between the third embodiment and the second embodiment is that the heat conduction structure further includes a heat conduction support 205, one end of the heat conduction support 205 is connected to the heat conduction ring 204, and the other end is connected to the auxiliary cold head 206. The cold head 206 is suitable for connecting with the second pipeline layer 301.
[0101] The heat conduction structure includes a thermal resistance mechanism 210, one end of the thermal resistance mechanism 210 is connected to the refrigeration cold head 2, and the other end is connected to the second pipeline layer 301.
[0102] Since the thermal resistance mechanism 210 has thermal resistance, the temperature of the cold energy transferred from the thermal resistance mechanism 210 to the second pipeline layer 301 is higher than that of the refrigeration cold head 202 to the fourth pipeline layer. 101 The temperature of the cooling capacity provided.
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