Automobile rectifier diode mounting structure

Abstract

The invention discloses an automobile rectifier diode mounting structure for an automobile rectifier, and belongs to the technical field of automobile rectification. A rectifier diode press-fitting structure comprises a diode and a heat dissipation plate, wherein the upper surface of the heat dissipation plate is provided with a sinking groove; the bottom of the sinking groove is provided with a through groove communicating with the upper and lower surfaces of the heat dissipation plate; the bottom of the sinking groove is further provided with a positioning groove; the circumferential surfaceof the diode is provided with a copper base; the copper base is correspondingly disposed in the positioning groove on the sinking groove; a cover plate is fixed in the sinking groove; and a through hole corresponding to the diode is formed on the cover plate. Compared with the ordinary press-fitting structure, the automobile rectifier diode mounting structure adopts the cooperation of the heat dissipation plate and the cover plate to clamp the copper base of the diode; on the whole, the processing is simpler, and the rejection rate is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of automobile rectification, in particular to an automobile rectifier diode installation structure used on the automobile rectifier. Background technique [0002] At present, the assembly of diodes and heat sinks on automotive rectifiers are all sintered in one piece. This kind of production process is complex, high cost and long working hours. This type of assembly requires the diode to be sintered to the heat sink. However, the high temperature and stress during sintering will affect the diode chip. After sintering, the damage rate of the chip is as high as 40%, and it must be reworked. At the same time, the melting point of the solder paste is too low, and the rectifier will generate high temperature during operation, which will easily cause the sintered solder paste to melt, causing the product to suddenly fail, causing serious consequences to the customer terminal. This sintering method is complicated...

AI Technical Summary

Problems solved by technology

However, the high temperature and stress during sintering will affect the diode chip. After sintering, the chip damage rate is as high as 40%, and it must be reworked.

At the same time, the melting point of the solder paste is too low, and the rectifier will generate high temperature during operation, which will easily cause the sintered solder paste to melt, causing the product to fail suddenly and causing serious consequences to the customer terminal

This sintering method is complicated. It is necessary to apply solder paste on the fixed position of the heat sink first, then place the diode on the solder paste, and fix the position of the diode with a sintering fixture to prevent the diode from moving when the solder paste melts, and then put it into the tunnel for sintering. Furnace for sintering, this sintering process takes 15-20 minutes, low work efficiency

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