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High-reliability browning method of PCB copper assembly

A reliability and component technology, applied in the direction of electrical components, printed circuit components, printed circuit secondary processing, etc., can solve the problems of low operating efficiency, affecting production efficiency, and difficulty in the browning of embedded copper components, to avoid Explosive board layering, avoiding the effect of filling voids

Inactive Publication Date: 2018-09-28
奥士康精密电路(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the browning of pre-embedded copper components is more difficult. Usually, browning is carried out by soaking in a beaker or attaching high-temperature red tape to cross the horizontal browning line.
This kind of method has disadvantages such as easy browning and rubbing, potion residue and drying failure, etc., which will lead to failure of high-risk functions such as PP filling voids, interface delamination and explosion, and there are problems such as low operation efficiency, easy to drop the cylinder, and jamming. , which greatly affects production efficiency and cannot meet the needs of high-efficiency production and high-quality reliability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A high-reliability browning method for PCB copper components, comprising the steps of:

[0021] a. Encapsulate the copper components into the jig, place them on the conveyor belt, and perform pre-browning treatment;

[0022] b. Copper components are transported to the browning section for browning;

[0023] c. After the browning is completed, the copper components are transported to the washing section for washing;

[0024] d. Copper components are transported to the drying section for drying and then transferred to the next process;

[0025] The transmission speed of the conveyor belt is 3.0 m / min, and the technical parameters of the browning in step b are: spray pressure: 2.5 Kg / cm2; browning liquid flow control: 35 L / min; micro-etching rate: 80 u"; Cu2+ concentration : 28g / L; browning temperature: 35 ℃.

[0026] Among them, the technical parameters of water washing in step c are: water washing spray pressure: 2.0 Kg / cm2; water washing flow control: 8 L / min.

[00...

Embodiment 2

[0032] A high-reliability browning method for PCB copper components, comprising the steps of:

[0033] a. Encapsulate the copper components into the jig, place them on the conveyor belt, and perform pre-browning treatment;

[0034] b. Copper components are transported to the browning section for browning;

[0035] c. After the browning is completed, the copper components are transported to the washing section for washing;

[0036] d. Copper components are transported to the drying section for drying and then transferred to the next process;

[0037] The transmission speed of the conveyor belt is 2.5 m / min, and the technical parameters of the browning in step b are: spray pressure: 3 Kg / cm2; browning liquid flow control: 25 L / min; micro-etching rate: 40 u"; Cu2+ concentration : 30 g / L; browning temperature: 41°C.

[0038] Among them, the technical parameters of water washing in step c are: water washing spray pressure: 1.5Kg / cm2; water washing flow control: 10 L / min.

[003...

Embodiment 3

[0044] A high-reliability browning method for PCB copper components, comprising the steps of:

[0045] a. Encapsulate the copper components into the jig, place them on the conveyor belt, and perform pre-browning treatment;

[0046] b. Copper components are transported to the browning section for browning;

[0047] c. After the browning is completed, the copper components are transported to the washing section for washing;

[0048] d. Copper components are transported to the drying section for drying and then transferred to the next process;

[0049] The transmission speed of the conveyor belt is 2.5 m / min, and the technical parameters of the browning in step b are: spray pressure: 2 Kg / cm2; browning liquid flow control: 25 L / min; micro-etching rate: 40 u"; Cu2+ concentration : 20 g / L; browning temperature: 35 ℃.

[0050] Among them, the technical parameters of water washing in step c are: water washing spray pressure: 2.5 Kg / cm2; water washing flow control: 12 L / min.

[00...

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PUM

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Abstract

The invention relates to the field of PCBs, and discloses a high-reliability browning method of a PCB copper assembly. The high-reliability browning method comprises the following steps of (a) packaging the copper assembly in a jig, placing the jig on a conveying belt, and performing browning pre-processing; (b) transmitting the copper assembly to a browning segment for browning; (c) transmittingthe copper assembly to a washing segment for washing after browning is completed; and (d) transmitting the copper assembly to a dry8ing segment, and forwarding to a next process after drying. According to the browning method, a relatively good browning effect can be obtained by optimizing a series of parameters and process steps.

Description

technical field [0001] The invention relates to the field of PCBs, in particular to a high-reliability browning method for PCB copper components. Background technique [0002] With the multi-functional development of electronic information technology, in order to meet the requirements of high performance, high assembly density, signal integrity, signal reception and shielding matching, increase the heat dissipation area of ​​PCB and assembly components, and ensure the stability of surface components In the application design, there is a design scheme of embedding heat dissipation copper components inside the PCB, which fully expands the application functions of the PCB. [0003] However, the browning of pre-embedded copper components is difficult, and browning is usually carried out by soaking in a beaker or attaching a high-temperature red tape to cross the horizontal browning line. This kind of method has disadvantages such as easy browning and rubbing, potion residue and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/38
CPCH05K3/383H05K1/0204
Inventor 付雷张恺贺波
Owner 奥士康精密电路(惠州)有限公司