Processing method of polytetrafluoroethylene silver-plated plate and polytetrafluoroethylene silver-plated plate
A technology of polytetrafluoroethylene and processing methods, which is applied to the reinforcement of conductive graphics, coating of non-metallic protective layers, printed circuits, etc., can solve problems such as oil loss, insufficient surface activity of materials, and foaming of silver-plated layers, and achieve Prevent blackening and yellowing, protect product quality, and have good industrial application prospects
Active Publication Date: 2022-04-15
珠海杰赛科技有限公司 +2
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Problems solved by technology
[0003]
However, in the production process of the silver-plated plate of PTFE material, due to the need to grind the plate before silver-plating and the long storage time, the surface activity of the material is insufficient, the solder mask will lose oil, and plasma activation is required
During the plasma activation process, the surface of the silver-plated plate will turn black and yellow, and even the silver-plated layer will bubble, which will lead to the scrapping of the silver-plated plate
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[0021] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are only for explaining the present, and should not be construed as limiting the present.
[0022] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation...
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The invention discloses a processing method of a polytetrafluoroethylene silver-plated plate, which comprises the following processing steps of: forming a circuit pattern on a polytetrafluoroethylene silver-plated plate surface of an outer layer circuit to complete the outer layer circuit pattern; silver plating: electroplating a silver plating layer on the surface of the polytetrafluoroethylene silver plating plate; plasma activation is conducted, specifically, a plasma activation procedure is conducted on the polytetrafluoroethylene silver-plated plate, and the temperature of the plasma activation procedure ranges from 25 DEG C to 30 DEG C; and resistance welding: coating a layer of resistance welding on the plate surface of the polytetrafluoroethylene silver-plated plate through silk-screen printing or coating of resistance welding ink, and exposing a bonding pad to be welded through exposure and development. The activation temperature of the plasma activation procedure is controlled between 25 DEG C and 30 DEG C, the silver coating can be prevented from blackening or generating at the too high temperature, the situation that the silver coating foams due to the too high temperature can be avoided, and therefore the product quality of the polytetrafluoroethylene silver-plated plate is guaranteed, the requirements of customers are met, and good industrial application prospects are achieved.
Description
technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a processing method of a polytetrafluoroethylene silver-plated plate and the polytetrafluoroethylene silver-plated plate. Background technique [0002] A printed circuit board (Printed Circuit Board, PCB), also known as a printed circuit board, is a support for electronic components and a carrier for electrical connections of electronic components. With the continuous progress and development of communication technology, more and more PCB substrates are processed with high-frequency and high-speed materials. The main material of the substrate basically belongs to the component structure of PTFE (polytetrafluoroethylene) + glass fiber + ceramics , Widely used in aerospace, aviation, satellite communications, navigation, radar and other high-tech fields. Due to the particularity of the workplace, higher reliability requirements are put forward for PCB products. [...
Claims
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IPC IPC(8): H05K3/00H05K3/24H05K3/28
Inventor 蔡永伦张良昌吴传亮齐国栋
Owner 珠海杰赛科技有限公司