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Thick copper circuit board and preparation method thereof
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A technology of thick copper circuit board and inner layer board, which is applied in printed circuit manufacturing, printed circuit, circuit thermal device, etc. Effect
Inactive Publication Date: 2018-10-02
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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[0004] The traditional PCB board is connected with a heat-dissipating carrier board on the surface of the circuit board. The carrier board is a heat-conducting metal, which itself plays the role of heat conduction and heat dissipation. However, in thick copper circuit boards, the heat dissipation speed is relatively slow, and the heat dissipation effect is not ideal.
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preparation example Construction
[0031] A method for preparing thick copper circuit boards includes the following steps:
[0032] S1. Obtain an inner layer board, and drill a heat dissipation hole on the heat dissipation area of the inner layer board;
[0033] Understandably, the thickness of the inner layer board is 4OZ-10OZ, and the aperture of the heat dissipation holes is ≥φ0.4mm. The number of heat dissipation holes can be based on the actual heat dissipation requirements without affecting the circuit performance of the inner layer board. Make adjustments.
[0034] S2. Silk-print resin in the heat dissipation holes to obtain an inner plug hole plate;
[0035] Understandably, before plugging the hole, it also includes electroplating the heat dissipation hole so that the inner wall of the heat dissipation hole is plated with copper, and plugging the hole after electroplating, there is no risk of scratches on the board surface.
[0047] This embodiment provides a thick copper circuit board and a preparation method thereof, including the following steps:
[0048] S1. Obtain the inner plate and drill heat dissipation holes in the heat dissipation area of the inner plate, such as figure 1 Shown.
[0049] The thickness of the inner layer board is 6OZ, the aperture of the heat dissipation hole is φ0.4mm, and the number of heat dissipation holes is about 50.
[0050] S2, electroplating the heat dissipation hole, and plating copper on the inner wall of the heat dissipation hole.
[0051] S3. Silk-screen resin in the heat dissipation hole.
[0052] When screen printing resin, use aluminum sheet selective screen printing resin to fill the heat dissipation holes. The resin is SANEN IR-6P, screen printing once, speed 5+ / -1m / min.
[0053] S4. The ceramicgrinding process is used to smooth the area of the heat dissipation holes to obtain the inner plug hole plate;
[0054] S5. Press and bond the inner plug orifice board t...
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Abstract
The invention relates to a preparation method of a thick copper circuit board. The method comprises following steps of acquiring an inner layer plate and drilling heat dissipation holes in a heat dissipation region of the inner layer plate; carrying out silk printing on resin in the heat dissipation holes so as to obtain an inner layer plugging hole plate; carrying out press fitting on the inner layer plugging hole plate so as to obtain a multilayer plate; carrying out plate overlapping on the multilayer plate and allowing the heat dissipation region to be exposed; and carrying out silk printing on the heat dissipation printing ink in the heat dissipation region. According to the invention, heat dissipation requirements on thick copper circuit boards in the automobile electronic industry can be met.
Description
Technical field [0001] The invention relates to the field of printed circuit boards, in particular to a thick copper circuit board and a preparation method thereof. Background technique [0002] PCB is an abbreviation of printed circuit board, an important electronic component, and its development prospects are very broad. With the gradual evolution of automobiles from mechanical products in the traditional sense to high-tech products of mechatronics, intelligence and information, automotive electronics has become the third largest application field of PCBs after computers and communication equipment. Therefore, there is an increasing demand for thick copper PCB circuit boards for automobiles. [0003] However, the high voltage makes the thick copper PCB of the automobile generate high heat. The heat dissipation capacity of the PCB board is an important indicator that affects the use of the PCB board. For the thick copper PCB board, the heat dissipation effect is particularly impo...
Claims
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Application Information
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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0201H05K3/00
Inventor 戴匡
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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