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Dicing method and laser processing apparatus

A cutting method and laser processing technology, applied in metal processing, laser welding equipment, metal processing equipment, etc., can solve problems such as difficult lenses and substrates

Active Publication Date: 2018-10-09
株式会社PANGEA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this stealth processing, it is difficult to accurately measure the distance between the processing lens and the substrate

Method used

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  • Dicing method and laser processing apparatus
  • Dicing method and laser processing apparatus
  • Dicing method and laser processing apparatus

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Embodiment Construction

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. This embodiment does not limit the present invention.

[0017] figure 1 An example of the cutting method of this embodiment is shown.

[0018] Laser light LA ​​is irradiated to the substrate 1 whose front surface is covered with a protective tape (not shown). The protective tape is used to protect semiconductor elements formed on the front surface of the substrate 1 . The substrate 1 is, for example, a silicon substrate. figure 1 A cross-sectional view of the substrate 1 during laser irradiation is shown.

[0019] By irradiating laser light along a line along which the substrate 1 is to be cut and focusing the laser light inside the substrate, the modified layer SD in which the crystal alignment is collapsed is formed inside the substrate. Starting from this modified layer SD, cracks (cutting lines) extending up and down the substrate are generated.

[0020] Further...

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PUM

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Abstract

According to one embodiment, a dicing method and a laser processing apparatus, being able to improve the measurement precision of the distance between a lens for processing and a substrate. The dicingmethod includes the steps: detecting the substrate information of the first part and the substrate information of the second part which is different from the first part; ccording to the substrate information of the first part and the second part, calculating the distance information between the substrate and the lens for processing; and according to the distance information, irradiating the laserto the substrate by using the lens for processing.

Description

[0001] [Related applications] [0002] This application enjoys the priority of the basic application based on Japanese Patent Application No. 2017-57716 (filing date: March 23, 2017). This application includes the entire content of the basic application by referring to this basic application. technical field [0003] Embodiments of the present invention relate to a cutting method and a laser processing device. Background technique [0004] As a dicing method for dividing a substrate on which semiconductor elements are formed into individual chips, stealth processing is known in Japanese Patent Laid-Open Publication No. 2008-87027 or the like, in which laser light is irradiated onto the substrate through a processing lens. end. In this stealth processing, it is difficult to accurately measure the distance between the processing lens and the substrate. Contents of the invention [0005] Embodiments of the present invention provide a dicing method and a laser processing ap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/06
CPCB23K26/0648B23K26/38B23K26/0006B23K26/032B23K26/04B23K26/08B23K26/53B23K2101/40B23K2103/50H01L21/67092H01L21/67259H01L21/78B23K26/0884B23K26/364H01L21/268H01L21/6836H01L22/20H01L2221/68327
Inventor 藤田努大野天颂
Owner 株式会社PANGEA