Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed circuit board and display device

A printed circuit board, conductive layer technology, applied in printed circuits, circuit devices, printed circuits, etc., can solve the problems of signal reflection, impedance discontinuity, etc.

Active Publication Date: 2019-11-26
HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The impedance of the connection structure is usually much lower than the impedance of the signal line, which will cause the impedance discontinuity during the signal transmission process, which will cause problems such as signal reflection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board and display device
  • Printed circuit board and display device
  • Printed circuit board and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] In order to achieve impedance matching between the signal line and the connection structure, Embodiment 1 of the present invention provides a printed circuit board, figure 2 It is a schematic diagram of the film layer structure of the printed circuit board provided by Embodiment 1 of the present invention, image 3 for figure 2 Bottom view of the film layer above the substrate of the printed circuit board. combine figure 2 and image 3 As shown, the printed circuit board includes insulating and spaced multi-layer conductive layers 21-25 and multiple connection structures 26, the multi-layer conductive layers 21-25 are stacked, and an insulating spacer layer is arranged between every two conductive layers. Each connection structure 26 runs through each conductive layer 21 - 25 , and the connection structure 26 connects the first signal line L1 respectively located in the conductive layer 21 and the second signal line L2 located in the conductive layer 22 . Except ...

Embodiment 2

[0041] Embodiment 2 of the present invention provides a display device, including an array substrate and a printed circuit board connected to the array substrate, and the printed circuit board is the printed circuit board provided in Embodiment 1. Optionally, a driving chip is arranged on the printed circuit board, and the printed circuit board is used to provide a driving signal of the driving chip to the array substrate.

[0042] The display device can be any product or component with a display function such as electronic paper, OLED panel, mobile phone, tablet computer, TV, monitor, notebook computer, digital photo frame, navigator, etc.

[0043] Since the printed circuit board provided by the present invention can realize impedance matching, improve the consistency of impedance during signal transmission, and reduce the signal reflection problem caused by impedance mismatch, therefore, the signal transmitted by the printed circuit board to the array substrate is more accura...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present disclosure provides a printed circuit board including a plurality of conductive layers separated by insulating medium and a plurality of connection structures. Each connection structure penetrates each of the conductive layers. The plurality of conductive layers comprises a first conductive layer in which first signal lines are located and a second conductive layer in which second signal lines are located, and the first and second signal lines are connected via the connection structures. Anti-pads surrounding the connection structures are provided on others of the plurality of conductive layers except the first and the second conductive layers. For a same connection structure, the anti-pads surrounding the connection structure include adjacent anti-pads and nonadjacent anti-pads. Size of the adjacent anti-pads in any direction parallel to the conductive layers is smaller than that of the nonadjacent anti-pads. The present disclosure also provides a display apparatus.

Description

technical field [0001] The invention relates to the field of electronic products, in particular to a printed circuit board and a display device. Background technique [0002] The printed circuit board (Printed Circuit Board, PCB board) is the physical support of electronic products and an important part of signal transmission. The transmission of signals on the printed circuit board (especially the transmission of differential signals) requires high continuity of signal line impedance. . On the printed circuit board, when the signal lines of different layers are connected, they are connected through the connection structure. When there are other conductive layers between the layers where the two signal lines connected by the connection structure are located, the part of these conductive layers surrounding the connection structure is hollowed out, and the hollowed out area is called the anti-pad of the connection structure. The impedance of the connection structure is usual...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0251H05K2201/0784G09G3/20H05K1/115H05K3/429H05K2201/09454H05K2201/09463H05K2201/09636H05K2201/09709G09G3/32H05K1/0242H05K1/0298
Inventor 谢恩明韦晓龙曹春鲍文超
Owner HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products