Printed circuit board and display device

A printed circuit board, conductive layer technology, applied in printed circuits, circuit devices, printed circuits, etc., can solve the problems of signal reflection, impedance discontinuity, etc.
CN108633172BActive Publication Date: 2019-11-26HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
Publication Date
2019-11-26

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Abstract

The present disclosure provides a printed circuit board including a plurality of conductive layers separated by insulating medium and a plurality of connection structures. Each connection structure penetrates each of the conductive layers. The plurality of conductive layers comprises a first conductive layer in which first signal lines are located and a second conductive layer in which second signal lines are located, and the first and second signal lines are connected via the connection structures. Anti-pads surrounding the connection structures are provided on others of the plurality of conductive layers except the first and the second conductive layers. For a same connection structure, the anti-pads surrounding the connection structure include adjacent anti-pads and nonadjacent anti-pads. Size of the adjacent anti-pads in any direction parallel to the conductive layers is smaller than that of the nonadjacent anti-pads. The present disclosure also provides a display apparatus.
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Description

technical field

[0001] The invention relates to the field of electronic products, in particular to a printed circuit board and a display device. Background technique

[0002] The printed circuit board (Printed Circuit Board, PCB board) is the physical support of electronic products and an important part of signal transmission. The transmission of signals on the printed circuit board (especially the transmission of differential signals) requires high continuity of signal line impedance. . On the printed circuit board, when the signal lines of different layers are connected, they are connected through the connection structure. When there are other conductive layers between the layers where the two signal lines connected by the connection structure are located, the part of these conductive layers surrounding the connection structure is hollowed out, and the hollowed out area is called the anti-pad of the connection structure. The impedance of the connection structure is usual...

Claims

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