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Preparation method of circuit board

A circuit board, one-line technology, which is applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, and printed circuits, etc., can solve the problems of complicated pattern transfer process steps and high manufacturing costs, and reduce manufacturing costs and steps. simple effect

Active Publication Date: 2018-10-12
SHANGHAI LIANGZI HUIJING ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned shortcoming of prior art, the object of the present invention is to provide a kind of preparation method of circuit board, is used to solve the pattern in existing circuit board preparation method The transfer process has the problems of complicated steps and high production costs

Method used

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  • Preparation method of circuit board
  • Preparation method of circuit board
  • Preparation method of circuit board

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Embodiment 1

[0052] Such as Figure 1 to Figure 14 As shown, the present embodiment provides a preparation method of a circuit board, the preparation method comprising:

[0053] providing a circuit substrate 201, and forming a flexible material layer 204 on the upper surface of the circuit substrate 201;

[0054] forming a protruding structure 206 on the upper surface of the circuit substrate 201 through the mold 10; and

[0055] forming a circuit layer 207 on the circuit substrate 201 through the protruding structure 206;

[0056] Wherein, the mold 10 includes: a mold substrate 101 with a recessed structure 104 on the lower surface, and a shielding layer 107 formed on the lower surface of the mold substrate 101 and the sidewall surface of the recessed structure 104; wherein, the The shielding layer 107 forms a light adjustment channel for adjusting the light emitted by the exposure light source above the mold 10 , so that the light is collected and irradiated on the flexible material la...

Embodiment 2

[0076] Such as Figure 15 to Figure 20 As shown, the present embodiment provides a preparation method of a circuit board, the preparation method comprising:

[0077] providing a circuit substrate 301, and forming a flexible material layer 302 on the upper surface of the circuit substrate 301;

[0078] forming a protruding structure 304 on the upper surface of the circuit substrate 301 through the mold 10; and

[0079] forming a circuit layer 305 on the circuit substrate 301 through the protruding structure 304;

[0080]Wherein, the mold 10 includes: a mold substrate 101 with a recessed structure 104 on the lower surface, and a shielding layer 107 formed on the lower surface of the mold substrate 101 and the sidewall surface of the recessed structure 104; wherein, the The shielding layer 107 forms a light adjustment channel to adjust the light emitted by the exposure light source above the mold 10 , so that the light is collected and irradiated on the flexible material layer ...

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Abstract

The invention provides a preparation method of a circuit board. The preparation method comprises the following steps: providing a circuit substrate, and forming a flexible material layer on the uppersurface of the circuit substrate; forming a protrusion structure on the upper surface of the circuit substrate through a mold; and forming a circuit layer on the circuit substrate via the protrusion structure, wherein the mold comprises: a mold substrate provided with a depression structure on the lower surface, and a shielding layer formed on the lower surface of the mold substrate and on the side wall surface of the depression structure; and the shielding layer forms a light adjustment channel to adjust the light emitted by an exposure light source disposed above the mold so as to concentrate and irradiate the light on the flexible material layer that is not shielded by the shielding layer. By adoption of the preparation method of the circuit board provided by the invention, the problemsof complicated steps and high production cost of a pattern transfer process in the existing circuit board preparation method are solved.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for preparing a circuit board. Background technique [0002] As far as electronic products are concerned, printed circuit boards (PCBs) are the indispensable main basic parts of electronic products. Moreover, with the vigorous development of the electronics and communication industries, LCD TVs, mobile phones, digital cameras, digital video cameras, and other 3C products are all light, thin, and small. With the emergence of wearable devices, printed circuit boards also need to have Features of high density, small size, and free installation. It can be seen that with the continuous development of electronics and communication products, there are high density, high pin count (High Density / High Pin Count), miniaturization (Fine Pitch), group bonding (Gang Bond), high output (High Throughput) and high The demand for circuit boards with characteristics such as High Rel...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0014H05K3/0023H05K3/06H05K2203/0108
Inventor 林晓辉成海涛孟志成顾永新
Owner SHANGHAI LIANGZI HUIJING ELECTRONICS CO LTD