Silicon chip degumming technology

Abstract

The invention discloses a silicon chip degumming technology. The technology comprises following steps of placing a silicon sheet in a processing pool; adding de-ionized water in the processing pool; adding degumming liquid in the processing pool; allowing the silicon sheet stand for 35-50 min; carrying out spray-washing processing; controlling the temperature of the spray-washing water to be 30-35DEG C; placing the processed silicon sheet into the processing pool again and adding degumming liquid; vibrating the silicon sheet under the condition of 50-60 DEG C; after the silicon sheet reacts with the degumming liquid for 3-6min, carrying out ultrasonic cleaning on the silicon sheet; placing the vibrated silicon sheet in an ultrasonic cleaner for immersion; placing the silicon sheet in a surface processing pool again; adding surface processing liquid in the surface processing pool; immersing the silicon sheet for 30-50 min in the environment of 35-45 DEG C; and carrying out spray-washing processing again. According to the invention, residue glue on the silicon sheet is completely cleaned, degumming quality is ensured and the surface of the silicon sheet can be protected against damage.

Description

technical field

[0001] The invention relates to the technical field of silicon wafer processing, in particular to a silicon wafer degumming process. Background technique

[0002] With the continuous development of the world economy, the demand for high-efficiency energy in modernization is increasing. Photovoltaic power generation, as one of the main energy sources for green energy and sustainable development of human beings, has been increasingly valued by countries all over the world and has been vigorously developed. Monocrystalline silicon wafers and polycrystalline silicon wafers, as the basic materials of solar cells for photovoltaic power generation, have extensive market demand.

[0003] The silicon wafer cleaning process is the last process of producing silicon wafers. In this process, two types of cleaning equipment are mainly used. One is a solar silicon wafer degumming machine, which is mainly used to pre-process the silicon wafers after multi-wire cutting. Cle...