Composite board and preparation method thereof, shell and electronic equipment

A technology for composite sheets and electronic equipment, applied in the field of materials, can solve the problems that the hardness and scratch resistance of the composite sheet cannot meet the requirements, the electronic equipment is easily broken or scratched, and the consumer experience cannot be satisfied, and the hardness can be improved. and the effects of scratch resistance, high densification, best hardness and impact resistance

Inactive Publication Date: 2018-11-02
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Currently on the market, electronic equipment casings such as composite panels used in mobile phone casings, such as ABS+PMMA / PC+PMMA composite panels, due to the brittle physical properties of PMMA, the impact strength of the composite panels is low, making electronic equipment drop It is easy to crack or notch; and the hardness and scratch resistance of the composite sheet used in the current electronic equipment shell are far from meeting the requirements, so that the electronic equipment is easy to be broken or scratched, which cannot meet the consumption experience of consumers.
[0003] Thereby, the casing of current electronic equipment still needs to be improved

Method used

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  • Composite board and preparation method thereof, shell and electronic equipment
  • Composite board and preparation method thereof, shell and electronic equipment
  • Composite board and preparation method thereof, shell and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Composite panels include:

[0067] Impact-resistant layer: the forming material is PC (impact resistance is 6J), and the thickness is 0.4mm;

[0068] Hard layer: the forming material is PET (hardness 2H), and the thickness is 0.1mm;

[0069] Reinforcing layer: the thickness is 0.01mm, and the strengthening liquid forming the reinforcing layer includes 25 parts by weight of acrylic resin, 0.3 parts by weight of silicone resin, 24 parts by weight of hydroxy ketones, 6 parts by weight of acyl phosphine oxide, and 0.4 parts by weight of isopropanol, 1.6 parts by weight of propylene glycol methyl ether, 11.3 parts by weight of silicon dioxide dispersion, 0.3 parts by weight of leveling agent, wherein, the strengthening solution before dilution / diluted strengthening solution=25wt%, and the curing energy is 350MJ / cm 2 .

Embodiment 2

[0071] Composite panels include:

[0072] Impact-resistant layer: the forming material is high-toughness PC (impact strength is 8J), and the thickness is 0.6mm;

[0073] Hard layer: the forming material is high-hardness PET (hardness 3H), and the thickness is 0.2mm;

[0074] Reinforcing layer: the thickness is 0.05mm, and the strengthening liquid forming the reinforcing layer includes 55 parts by weight of acrylic resin, 0.5 parts by weight of silicone resin, 44 parts by weight of hydroxy ketones, 16 parts by weight of acyl phosphine oxide, and 0.6 parts by weight of isopropanol, 1.8 parts by weight of propylene glycol methyl ether, 25.3 parts by weight of silicon dioxide dispersion liquid, 0.5 parts by weight of leveling agent, wherein, strengthening liquid before dilution / diluted strengthening liquid=35wt%, curing energy is 410MJ / cm 2 .

Embodiment 3

[0076] Composite panels include:

[0077] Impact-resistant layer: the forming material is PC, the thickness is 0.5mm;

[0078] Hard layer: the forming material is PET, the thickness is 0.15mm;

[0079] Reinforcing layer: the thickness is 0.03mm, and the strengthening liquid forming the reinforcing layer includes 35 parts by weight of acrylic resin, 0.4 parts by weight of silicone resin, 34 parts by weight of hydroxy ketones, 10 parts by weight of acyl phosphine oxide, 0.5 parts by weight of isopropanol, 1.7 parts by weight of propylene glycol methyl ether, 0.4 parts by weight of leveling agent, wherein, strengthening liquid before dilution / diluted strengthening liquid=30wt%, curing energy is 380MJ / cm 2 .

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Abstract

The invention provides a composite board and a preparation method thereof, a shell and electronic equipment, wherein the composite board comprises an impact-resistant layer, a hard layer and an enhancing layer, wherein the hard layer is arranged on the first surface of the impact-resistant layer; the enhancing layer is arranged on the surface of the hard layer separating from the impact-resistantlayer. The inventor discovers that the composite board is simple in structure and easy in implementation; under the matching action of the three-layer structure, the composite board is higher in hardness, resistant in scratching, better in toughness, higher in impact resistance and better in use performance.

Description

technical field [0001] The invention relates to the field of material technology, and in particular, to a composite plate and a preparation method thereof, a housing and electronic equipment. Background technique [0002] Currently on the market, electronic equipment casings such as composite sheets used in mobile phone cases, such as ABS+PMMA / PC+PMMA composite sheets, due to the brittle physical properties of PMMA, the impact strength of the composite sheet is low, making electronic equipment drop It is easy to crack or notch; and the hardness and scratch resistance of the composite sheet used in the electronic device shell are far from meeting the requirements, so that the electronic device is easy to be broken or scratched, which cannot meet the consumption experience of consumers. [0003] Therefore, the housing of the current electronic equipment still needs to be improved. Contents of the invention [0004] The present invention aims to solve one of the technical pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/36B32B27/08B32B33/00C09D133/00C09D7/63C09D7/61C09D7/65
CPCB32B27/08B32B27/36B32B27/365B32B33/00B32B2255/10B32B2255/20B32B2307/558B32B2307/584C09D133/00C09D7/61C09D7/63C09D7/65C08L83/04C08K3/36C08K5/06C08K5/05
Inventor 杨光明丁文峰
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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